TRENCHSTOP™ 5 S5 in TO-220-3
Highest power density IGBT in a small footprint
650V TRENCHSTOP™ 5 is recognized leading IGBT thin-wafer technology. Now also available in small footprint packages like TO-220-3 enables higher power designs in a compact size. Apart from high current density in small package low losses of the TRENCHSTOP™ 5 benefits to low junction temperature of the device, consequently less cooling, longer operational cycles and high life time expectancy.
Other product highlights that might be of interest to you
600 V / 650 V IGBT Portfolio for Drives applications
The new 650V TRENCHSTOP™ 5 S5 in TO-220 can be used in different applications requiring high current density in a small package size.
One of such application is motor driver inverter for professional use corded power tools. Traditionally the power switches used in motor drive inverter, like B6 topology, require capability to withstand short circuit event of 5-3µsec. However now many motor drive manufacturers driven to have the lowest losses on the switch consider using lowest losses IGBTs, like TRENCHSTOP™ 5, in a design with an optimized protection circuit, that minimizes occurrence of a short circuit event. The key customer benefit here is the lowest losses on the power switch that allows longer operational cycles and reduced cooling requirements that impacts final product size and weight.
更高能效，外观时尚，易于清洁和密封表面等等只是工程师在小家电设计中必须考虑到的部分特征。 英飞凌针对两个关键领域提供解决方案 采用IPD Protect的感应加热——该器件是一个与保护栅极驱动器封装在一起的RC-H5 IGBT，以及电机控制解决方案——该解决方案使用我们的节能型集成功率器件CIPOS智能功率模块和iMOTION集成设计平台