Automotive IGBT modules based on leading IGBT technology designed for Hybrid electric and full Electric Vehicle (xEV) applications.
Infineon offers a wide range of automotive qualified IGBT Modules. Infineon´s HybridPACK™ and EasyPACK™ families extend across the full power spectrum required by IGBT modules in hybrid and electric vehicles. Various product versions in five different packages enable maximum scalability across voltage and power classes, from 50 A to 950 A and 400 V to 1200 V (nominal chip values), using our leading Automotive Silicon and CoolSiC TM Technologies.
Thanks to leading IGBT technologies our range of automotive qualified high-power modules all have one thing in common: They offer the highest power densities and efficiency. With several HybridPACK™ and EasyPACK™ product families to choose from, we can offer the best technical fit for a range of applications including traction inverter, on-board battery charger, auxiliary inverters and HV/LV DC-DC converter.
With our HybridPACK™ and EasyPACK™ products, Infineon offers a broad portfolio of half bridge and six-pack power semiconductor modules which have been specially designed and qualified for hybrid and electric vehicle applications. Thanks to the selection of five different packages addressing different power classes, versatility of design integration is provided and the best fitting product for each requirement can be offered.
HybridPACKTM DSC is Infineon’s new innovative solution for the main inverter of hybrid and electric vehicles. It offers increased power density due to double-sided cooling of the molded module. The die temperature and current sensors can help to drive the IGBT closer to their limit to further improve the power density. HybridPACK DSC modules offer scalability via stacking to support customers’ platform approach.
HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicle main inverter applications (xEV) for a power range up to 150 kW. The power module implements the new EDT2 IGBT chip generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions.
Infineon’s HybridPACK™ family extends across the full power spectrum required by IGBT modules in hybrid and electric vehicles. The various product versions are achieved through package innovations and chip development within the product portfolio.