HybridPACK™ DSC
HybridPACK™ DSC is the perfect high power density solution for your compact, flexible and integrated inverter design
Our emphasis on innovation is not only recognizable in the variety of frame-based power modules, but also in the HybridPACK™ DSC. Thanks to its double side cooling technology and half-bridge configuration, this power module is the ideal solution for compact, flexible and integrated Si-based main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability to support customers’ platform approach.
Infineon believes in Si IGBT and SiC MOSFET technology complementing each other and therefore will launch the next generation of HybridPACK™ DSC in 2023 with a CoolSiC™ chipset. This module will deliver up to double the performance compared to Si-based DSC-S solutions ceteris paribus.
- Very high power density package enabling very compact inverters
- IGBT3 and EDT2 chip offers benchmark efficiency for electric vehicle inverters
- Advanced on-chip-temperature and current sensor
- Offers advanced reliability & robustness
- Proven package with over 3.5 Mio DSC modules already in use in various hybrid and plug-in hybrid vehicles as of today
- Application notes, a new Evaluation Kit for DSC S1 and S2 using a reference cooler from BOYD Corporation is available on the Infineon Website