D-DPAK & Q-DPAK
CoolMOS™ SJ MOSETs and CoolSiC™ Schottky diode Gen 6 in Double & Quadruple DPAK (D-DPAK/Q-DPAK)
Innovative top-side cooled SMD solution for high power applications
With the D-DPAK package, Infineon Technologies introduced the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.
The benefits of the already existing high voltage technologies 600 V CoolMOS™ G7 superjunction (SJ) MOSFET, CFD7, S7 and CoolSiC™ Schottky diode 650 V G6 are combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
With the latest Q-DPAK package, Infineon extends the top-side cooling offering even further. The Q-DPAK package is twice as big as the D-DPAK and allows for usage in higher power applications. It is not only the perfect choice for SMPS applications but also offers benefits for static- and slow-switching applications and therefore is available also within CoolMOS™ S7 (addressing industrial applications) and S7A families (addressing automotive applications).
Top-side cooling at a glance
SMD based SMPS designs support fast switching and help to reduce the parasitic inductance associated with long leaded packages such as the common TO-220 or TO247 package. In today’s SMD-based designs, the output power is restricted by the thermal limit of the PCB material because the heat must be dissipated through the board. Thanks to the top-side cooling concept of D-DPAK and Q-DPAK, the thermal decoupling of board and semiconductor is possible, enabling higher power density or improved system lifetime.
~20 percent higher power dissipation
D-DPAK based SMD solutions allow to reach up to 20 percent higher power dissipation on the board temperature level of a standard cooling concept enabling higher power density at a given form factor.
~12°C lower board temperature
D-DPAK based SMD solutions allow to drive the application at around 12°C lower board temperature on the output power level of a standard cooling concept leading to increased system lifetime. The same applies for Q-DPAK package. Thanks to the top-side cooling customers can either improve power density or system lifetime.
Innovative top-side cooled SMD solution for high power applications
D-DPAK & Q-DPAK offers an inbuilt 4pin Kelvin source configuration and very low parasitic source inductance. The seperate pin "source-sense" delivers undisturbed singals to the driver and therefore increases the ease-of–use level. The combination of this 4pin functionality together with Infineon’s latest superjunction MOSFET and CoolSiC™ Schottky diode technologies ensures highest efficiency levels and allows customers to reach the 80 PLUS® Titanium standard.