CoolMOS™ Packages

Overview

Revolutionary CoolMOS™ superjunction MOSFET technologies require innovative package solutions to enable tomorrow's trends

Low power applications are typically sold into the price sensitive consumer world where customers are closely looking into bill of material (BOM) cost savings. To allow savings, Infineon offers special package features that avoid additional assembly treatments on the customer's side as well as smaller packages, enabled by our outstanding CoolMOS™ superjunction technology.

High power applications are very performance oriented. To further improve efficiency and thermal behavior, even by considering smaller form factors, Infineon introduced packages with Kelvin Source functionality and with D-DPAK, the first top side cooled SMD package. Combine the benefits of the high voltage technologies 600 V CoolMOS™ G7 superjunction (SJ) MOSFET and CoolSiC™ Schottky diode 650 V G6 with the innovative concept of top-side cooling in D-DPAK. 

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Related documents

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Training

Why throughhole packages are still needed

Wondering why designers still choose through-hole packages for their designs? This interactive training will answer that and take a high level look at the different through-hole MOSFET packages currently on the market, using Infineon products as examples.

CoolMOS™ 7 in Thin-PAK 5x6 for more compact consumer SMPS applications

Infineon training CoolMOS™ 7 in ThinPAK in consumer SMPS applications

Chargers are part of our daily lives and we all want them to be smaller & lighter. Check out Infineon’s latest package solution for high density chargers & adapters.

700 V CoolMOS™ P7 superjunction MOSFET

Information on 700 V CoolMOS™ P7 for low power applications and the most important parameters related to flyback technologies.

eLearning 600 V/700 V/800 V CoolMOS™ P7 superjunction MOSFET in SOT-223 package – English

Information about the value of combining CoolMOS™ P7 with SOT-223 and how to properly use SOT-223 as a replacement for DPAK.

eLearning 600 V/ 700 V/ 800 V CoolMOS™ P7 superjunction MOSFET in SOT-223 package - Korean

Infineon banner elearning CoolMOS™ P7 with SOT-223

Information about the value of combining CoolMOS™ P7 with SOT-223 and how to properly use SOT-223 as a replacement for DPAK.

Discrete IGBT and CoolMOS™ solutions in the age of SiC for EV charging applications

In this online course you will learn about cost-optimized, but highly efficient electric vehicles charging solutions based on IGBT and CoolMOS™, and explore Infineon’s wide portfolio that supports every segment of the EV charging application.

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