パッケージング

セキュリティ・パッケージング・センター（Security Packaging Center）の取り扱い製品およびサービスは、メモリやコントローラIC向けのチップカードモジュールから、セキュリティIC向けモジュール、お客様別パッケージソリューションや受託組立にいたるまで多岐にわたります。

Product Type	Applications	Pitch	Dimensions	Thickness (max.)	Contact Surface
Matching Results: 19
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S-MFC5.8	Payment, GSM	14.25 mm	13 x 11.8	538.0 µm	NiAu
S-MFC5.6	Payment, GSM	9.5 mm	11 x 8.3	538.0 µm	NiAu
P-M5.1	Payment, Government Identification	14.25 mm	13 x 11.8	600.0 µm	CIN+
T-M5.1	Payment, Government Identification	14.25 mm	13 x 11.8	580.0 µm	CIN+
T-M5.3	Pay-TV	14.25 mm	13 x 11.8	580.0 µm	CIN+
T-M4.9	Payment, Government Identification	14.25 mm	13 x 11.8	580.0 µm	CIN
T-M4.8	GSM	14.25 mm	13 x 11.8	580.0 µm	CIN
S-MFC3.1	Healthcare, Ticketing, Loyalty, Access Control	9.5 mm	11 x 8.3	538.0 µm	NiAu
T-M3.2	Healthcare/, Ticketing, Loyalty, Access Control	9.5 mm	11 x 8.3	580.0 µm	CIN
P-MCC8-2-3	Payment, Access Control, e-Passport, Driver License, Transport, Government Identification	9.5 mm	8.1 x 5.15	340.0 µm	Ag
P-MCC2-2-1	Transport, Access Control	4.75 mm	10.3 x 2.9	340.0 µm	Ag
P-FTM8-2-1	Government Identation, e-Passport, Driver License	9.5 mm	8.2 x 5.7	260.0 µm	NiAu
T-M8.4	Payment, EMV SDA/DDA, ePurse, Loyalty, Access Control, Driver Licence, Transport	14.25 mm	13 x 11.8	580.0 µm	NiAu/NiAuPd
P-M8.4	Payment, Government Identification	14.25 mm	13 x 11.8	620.0 µm	NiAu
DSO-20	Embedded Security, Authentication, Integrity	1.27 mm	12.8 x 7.6	2.64 mm	Sn
TSSOP-28	Embedded Security, Trusted Platform Module	0.65 mm	9.7 x 4.4	1.1 mm	Sn
VQFN-8	Embedded Security, Authentication, Integrity	1.27 mm	5 x 6	900.0 µm	NiPdAuAg
VQFN-10	Embedded Security, Authentication, Integrity	1.27 mm	6 x 5	900.0 µm	NiPdAuAg
WQFN-6	Embedded Security, Authentication	0.65 mm	2.5 x 2.5	800.0 µm	Sn

Product Type

Applications

Pitch

Dimensions

Thickness (max.)

Contact Surface

Matching Results: 19