12V Automotive LED - Relay - Motor Control Multichannel low side SPI Driver IC TLE75008-ESD (SPIDER Plus) - Over Temperature Protection

Open online SPICE simulator circuit link: atv_12v_LED_lighting_valve_motor_driver_spider_TLE75008-ESD_OT.TSC

12V Automotive LED, Enhanced Relay & Motor Control Multichannel
low side SPI Driver IC TLE75008-ESD (SPIDER+)

Over-temperature protection in active mode (OT)

change simulation time:
"Analysis->Transient: Start - End Display"

The TLE75008-ESD is a SPI controlled 8 channel low side switch out of Infineon's new
SPIDER+ family. The SPIDER+ products offeres improved and added functionality, such
as Cranking capability, very low current consumption in sleep mode, an improved thermal
performance, enhanced diagnosis features via SPI (16 Bit) and an input mapping function
for the 2 direct inputs. An input status register in combination with the output status
monitor and the open load at OFF detection allows to track the entire path, from
microcontroller to the loads. A fail safe mode (Limp Home) supplied from battery maintains
the functionality even with missing digital voltage supply. Short circuit, over current and
over temperature shutdown secures the protection of the loads and the switch.

This test bench shows the behavior when the channels are heating-up and the junction
temperature reach the Over Temperature threshold due to the increased load current.
Each channel is turning-OFF at different times depending on the thermal model associated.
A reset signal is applied to all 4 channels to clear the fault latch.

THERMAL_MODEL=1: P=1W; T=85°C; PCB type: 1s0p 300mm2
THERMAL_MODEL=2: P=1W; T=85°C; PCB type: 1s0p 600mm2
THERMAL_MODEL=3: P=1W; T=85°C; PCB type: 1s0p footprint
THERMAL_MODEL=4: P=1W; T=85°C; PCB type: 2s2p
where: P=power injected in chip; T=ambient temperature

Observations:
1. It is required to let the TJ pin open (no external connection)
2. The convention is 1V=1°C

CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 | signal
0 0 0 0 0 0 0 0 | 0
0 0 0 0 0 0 0 1 | 1
0 0 0 0 0 0 1 0 | 2
0 0 0 0 0 0 1 1 | 3
0 0 0 0 0 1 0 0 | 4
0 0 0 0 0 1 0 1 | 5
0 0 0 0 0 1 1 0 | 6
0 0 0 0 0 1 1 1 | 7
0 0 0 0 1 0 0 0 | 8
..............................……………………….. .|......…..
1 1 1 1 1 1 1 0 | 254
1 1 1 1 1 1 1 1 | 255

The Ambient temperature of the entire chip can
be set by connecting a voltage source to TAMB
input pin.
Junction temperature can be monitored on TJx
output pin.
TJx is always TAMB + temperature due to
self-heating of power device.

The model contains 4 different Junction to
Ambient thermal networks associated to
different metallization and cooling areas.
To switch between the four networks available,
change the value of THERMAL_MODEL
parameter which can be found on the test bench

Fault flag (OT or OVL): ERRn_reg
Fault latch clear: HWCR_OCL_reg
Open Load Detection in OFF-State: DIAG_IOL_reg
Output Status Monitor: DIAG_OSM_reg

Switching channels in parallel
HWCR_PAR_reg register coding

HWCR_PAR0=1 CH0 & CH2
HWCR_PAR1=1 CH1 & CH3
HWCR_PAR2=1 CH4 & CH6
HWCR_PAR3=1 CH5 & CH7

PAR_reg | PAR3 PAR2 PAR1 PAR0
0 | 0 0 0 0
1 | 0 0 0 1
2 | 0 0 1 0
3 | 0 0 1 1
4 | 0 1 0 0
5 | 0 1 0 1
6 | 0 1 1 0
7 | 0 1 1 1
8 | 1 0 0 0
.........…...|........................................
14 | 1 1 1 0
15 | 1 1 1 1