power2 products – think and work
Europe’s premiere gathering for power electronics and applications is just around the corner. We hope you can join us at this year’s PCIM show in Nuremberg on May 27–29, 2008, and would be delighted to welcome you to our showcase in hall 12, booth 404.
With last year‘s motto,
E
eff = IC
2, we revealed our formula for energy efficiency based on innovation times competence squared. This year we aim to bring that same spirit of innovation to bear, once again demonstrating that you can count on our products to help keep your company ahead of the competition.
This year’s motto,
power
2 products – think and work, is our way of saying that we continue to drive integration break-throughs. Visit hall 12 and booth 404 to see what we have to offer.
Our experts will be standing by, eager to talk to you about the benefits our solutions can bring to your business. And you won’t want to miss our casual
happy hour get-together on May 28, 2008 from 5 to 7 pm – please do join us there.
Product Highlights
-
Business Unit Power Management & Drives, Power Management & Supplies Products:
CanPAK™;
900V CoolMOS™;
40V 60V 80V OptiMOS™ -
Business Unit Power Management & Drives, Industrial Power Products:
MIPAQ™;
PrimePACKTM2 & 3 (1700 & 1200V) - Traction/Industry;
EconoPackTM4;
3300 & 6500V IGBT 3 Trench;
PressFit Technology ;
SiCDiode;
IGBT4 1200V&17000V -
Business Unit Power Management & Drives, Consumer Power Products:
CIPOS™;
EiceDRIVER™ products 600V&1200V;
RC-H IGBT 3rd gen;
Isoface;
HybridPACK™ 1&2 -
Industrial Microcontroller:
XE166 family;
FOC (Field Oriented Controller) mit XC878
Speaker Slots
Tuesday, May 27
09:45am
Keynote : Higher junction temperature in power modules - a demand from hybrid cars, a potential for the next step increase of power density for various variable speed drives
Reinhold Bayerer, Infineon Standort Warstein
Session – High Voltage Devices, Room Paris
11:00am
6.5kV IGBT and FWD with trench and VLD technology for reduced losses and high dynamic ruggedness
Thomas Duetemeyer, Infineon
12:00pm
Robustness improvement of high-voltage IGBT by gate control
Tao Hong, Infineon
1:00pm
CIBH diode with superior soft switching behavior in 3.3kV modules for fast switching applications
Jürgen Biermann, Infineon Standort Warstein
Session – Automotive Systems, Room London
11:00am
Choosing a 3-phase PWM method for automotive applications
Dusan Graovac, Infineon
Wednesday, May 28
Session – Module Reliability, Room Paris
10:30am
Reliability of pressFIT connections
Thilo Stolze, Infineon Standort Warstein
11:00am
Ultrasonic metal welding as contact technology for state-of-the-art power modules
Roman Tschirbs, Infineon Standort Warstein
Session – Fast Switching Devices, Room London
11:30am
New 900 V voltage class for superjunction devices - A new horizon for SMPS and renewable energy applications
Markus Schmitt, Infineon
ECPE Round Table
2:00pm
Passives in Power Electronics
With Prof. Dr. Leo Lorenz as Round Table Participants, Infineon Standort Shanghai
Postersession, Start: 4:00pm, Foyer 2nd floor
PP29
Numerical investigation on thermal crosstalk of silicon dies in high voltage IGBT modules*
Thomas Hunger, Infineon Standort Warstein
*Nominated for the Young Engineer Award
Podium Discussion – Blue Efficiency the next Level for Design, BPD, PCIM Forum, Hall 12, Booth 366
12:30pm
MIPAQTM – the new efficiency
Martin Schulz, Infineon Standort Warstein
Podium Discussion – Designing for power efficiency – PSDE, PCIM Forum, Hall 12, Booth 366
4:00pm
Future Trends for Energy Efficient Systems
Gerald Deboy, Infineon Standort Villach
Thursday, May 29
Session: Protection Strategies, Room London
11:00am
A progressive way to integrate current measurement into modern power electronic systems
Martin Schulz, Infineon Standort Warstein
Special Session: Automotive Power, Room Mailand
10:00am
Semiconductors in hybrid drives applications - a survey lecture
Ingo Graf, Infineon Standort Warstein
11:00am
From vehicle drive cycle to reliability testing of power modules for hybrid vehicle inverter
Markus Thoben, Infineon Standort Warstein
Podium Discussion – PCIM Forum, Hall 12, Booth 366
1:20pm
CIPOSTM – Infineon´s contribution to realize high density energy efficient drive systems
Infineon
Session: Advanced IGBT Technology, Room Paris
2:30pm
600V reverse conducting trench field-stop IGBT for drives applications in thin wafer technology
Holger Rüthing, Infineon
Session: Power Factor Correction and Compensation, Room Amsterdam
2:30pm
2nd Generation FL-Ballast Controller saves System Costs and Energy
Michael Herfurth, Infineon Standort Warstein
3:00pm
Line- conducted EMI- behaviour of a high efficient PFC- stage without input rectification
Manfred Schlenk, Infineon Standort München