EconoPACK™ 2 & 3

Our high performance and flexible solution that fulfills high power density needs

EconoPACK™ 4

Rugged mechanical design with ultrasonic welded and injection-molded screw terminals

Econo IGBT Modules

Power Simulation IPOSIM

PressFIT Technology


Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material


A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

IGBT Module Finder