The bonding process
Copper wire bonding is a new bonding technology process. As in heavy-wire bonding, it
processes a copper bond wire of 100µm to 500µm. A different cutting process is
required because the copper bond wire cannot be cut like the aluminiumwire can, as it
is a lot harder.
The different bondingprocesses for semiconductor components are:
thermosonic ball wedge bonding (TS bonding),
ultrasonicwedgewedgebonding (US bonding).
The first two in the list usually use gold wire, whereas US bonding uses aluminium or
aluminium/silicon wire. This latter bonding process is often found as ultrasonic wedge
wedge bonding in differentmodels of all designs from all manufacturers.
Front contact between IGBTs and diodeswith aluminiumbondwires