511

PrimePACK

TM

module with copper bond wires and copper metallisation of

the chip surfaces

The lifetime calculation takes a central role in the design of an application. Following is

an example of a given load cycle and a complete calculation for the lifetime of the

IGBTs of a power module (the calculation of the diodes would follow the same pattern).

TheTC andPC charts fro

nd

ill be constituents of it.

Given is a load cycle with duration of 300s as depicted in

resulting from the

calculation of losses and the subsequent thermal calculation of the heatsink, baseplate

and junction temperature. Here, the module is operated periodically for 11s with a

current of 480A

RMS

, then for 10s with 425A

RMS

and for a further 2s with a current of

740A

RMS

. Always with the intervals shown in

n which no load is applied. To

simplify the example, the following parameters are assumed to be constant during

operation:

•

DC-bus voltageU

DC

=900V

•

IGBT switching frequency f

SW

= 4kHz

•

Fundamental frequency of theoutput current f

out

=50Hz

•

Power factor cos

ϕ

= 1

5

PrimePACK

TM

is aprotected trademark of InfineonTechnologies.

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