IGBT Modules - Technologies, Driver and Application (Second Edition) - page 520

Fig. 14.19
Standard solderingprocess in comparison to the improved soldering process
14.5.6Direct bond ceramics tobaseplate
Another way to increase theTC load change capability is to connect the ceramic directly
with the baseplate. The ceramic itself is necessary to insulate the baseplate from the
electrical system.
Fig. 14.20
Comparison of a conventional structure and a direct bond between the
baseplate and the ceramics
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