IGBT Modules - Technologies, Driver and Application (Second Edition) - page 504

Fig. 14.3
Concept todetermine the test cycles to prove the lifetime of an IGBTmodule
The next step is to determine the temperature profile taking the cooling conditions into
). To emulate the real application as closely as possible, it is also
necessary to allow data to be entered regarding the climatic conditions under which the
target application is to be operated
. Together with the temperature profile,
an overview of the temperature gradients is obtained in this way, for the component
areas to be considered. In an IGBT module, usually the junction temperature and the
derived reliability of the bond wire connections are of interest. Also the temperatures of
the system solder pad (solder layer between the baseplate and the DCB) and chip
solder pad (solder layer between the DCB and the semiconductor component) are of
Outdoor temperature [°C] -25 -20 -15 -10 -5 0
5 10 15 20 25 30
Days per year
5 10 10 20 25 30 45 50 50 50 35 35
Tab. 14.1
Temperature chart of the climatic conditions over one year
System solder and chip solder are still to be regarded as standard processes. In later
IGBT module generations such soldering processes may be replaced by bonding
techniques such as LTJ (chapte
and diffusion soldering (chapte
. These
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