The thermal situation can be improved by integrating the shunt directly into the IGBT
module instead of on the PCB. When arranged like this, the shunt is mounted on the
DCB of the module which gives it a good thermal connection to the heatsink of the
system. The better cooling thus achieved makes it possible to extent the performance
range of the application significantly upward in comparison to the use of shunts
mounted on the PCB. Current implementations in IGBT modules, such as in the
module familymade by Infineon andSEMITRANS
cover a nominal current rangeof up to several 100A.
IGBTmodulewith integrated shunts in theoutput phases
There are several different ways to read a shunt, depending essentially on the point at
which the shunt is integrated in the system
. If the shunt is positioned in the
DC connection of theDC-bus, a circuit like the one shown in
can be used. The
reference point of the read-out electronic on the DC connection lies between the shunt
and the output half-bridge of the inverter. The amplified output signal proportionate to
the current through the shunt can be picked off at resistor R
. The resistance values
and voltages shown here as examples enable mapping of a peak current of around
±100A. The combination of R
forms the frequency-response compensation
The benefit of the circuit shown here is that the operational amplifier can be operated on
0V/5V, i.e. even though no negative supply voltage is required, the shunt can still map
both positive and negative currents.
is a protected trademark of InfineonTechnologies.
is a protected trademark of SEMIKRON International GmbH.