10 Mechanical handling andmounting
Supplementary to the deliberations in chapter
his chapter looks at the external
connection and construction of IGBTmodules. This includes the connection techniques
to external components such as PC-boards, cables, bus bars and heatsinks. Further,
general aspects will be contemplated regarding the management of environmental
conditionswhich not only bear an influence during operation but also during storage and
transport of themodules.
10.2 Connection techniques
With electrical connections we need to differentiate between the power connections and
the auxiliary connections. As a further criterion the nominal current of the module is
crucial.With regard to these two aspects it is possible to draw up an overviewaccording
hich lists common connection methods. "C" stands for control terminals
and "L" for load (power) terminals.
(ca. 150A -
Overview of electrical connections for IGBTmoduleswith regard to the power
class and the connectionmethod (C: Control terminal; L: loador power terminal)
The selection of the most favourable connection method for the actual application
depends on various criteria:
Current capability of the connection or its electrical resistance.
Reliability of the connection for example with regard to vibration and corrosion
Selection with regard to whatever the connection is to be made to, such as a
PCB, cables or abus bar.
Complexity and expenditure inproduction of the final application, i.e. number of
the necessary work steps, investment in equipment, cycle time for completion
of the connection aswell as training of the staff.
For years the classic connection technique in the low power range has been the solder
, which ismore andmore replaced by press-fitting (chapter
and spring contacts (chapte
. In themedium power range, however, for
the control terminals solder and plug connectors (chapter
have been used