IGBT Modules - Technologies, Driver and Application (Second Edition) - page 109

2C
97
Fig. 2.36
Functional designof a conventional IPM
2.4.4 IGBTmouldedmodules
There are two types of moulded module: DIP (dual inline) and SIP (single inline)
packages. Both of these, like discrete IGBTs, are built on a lead frame. Normally, the
control electronics are integrated in themouldedmodule (moulded IPM).
While a purely lead frame construction is shown i
and the electrical contact is
created by soldering and bonding, there are other designs with a DCB substrate and a
PCB in addition to the lead frame.
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