Functional designof a conventional IPM
There are two types of moulded module: DIP (dual inline) and SIP (single inline)
packages. Both of these, like discrete IGBTs, are built on a lead frame. Normally, the
control electronics are integrated in themouldedmodule (moulded IPM).
While a purely lead frame construction is shown i
and the electrical contact is
created by soldering and bonding, there are other designs with a DCB substrate and a
PCB in addition to the lead frame.