molybdenum disk and the semiconductor chip). Furthermore, only sufficient pressure
can create sufficient low thermal transfer resistance to theheatsink.
packages are a specific type of press pack package that combines
design concepts from conventional press packs with elements of standard IGBT
modules. None of the variants need internal bond connections or soldering, so they
have superior load cycle capability (chapte
Press pack IGBTs are used mainly to substitute gate turn-off thyristors (GTOs) in high
power applications suchasmedium-voltage drives andFACT
Conventional press pack IGBT (a) andStakPak
2.4.3 Intelligent powermodules (IPMs)
Conventional intelligent power modules are constructed like standard IGBT modules
with an additional control and evaluation logic, which is located on a PCB integrated in
the IGBT module
left). In DIP-IPMs, the most common in the lower power
range, especially where the blocking voltage is less than 600V, the control and
evaluation logic is locatedon a lead frame or aPCB.
FACTS (Flexible AC Transmission System) includes a large number of applications in the area of energy
transmission and power quality.
is aprotected trademark of ABB Ltd.