Characteristics
The new Full-Pak solution combines the high electrical performance standards of Infineon second generation SiC Schottky diodes and the advantages of a full isolated package without significant impact on thermal behavior compared to standard TO-220 solutions. The patented diffusion soldering technique enables to consistently reduce the “Chip-to-lead frame” thermal resistance and positions Infineon FullPAK products as best-in-class performance. Additionally, Infineon offers the industry´s broadest portfolio in this package with current ratings up to 6A
Benefits
- Thermal behavior comparable to non-isolated package thanks to Infineon diffusion soldering
- Best thermal performance for full-pack solutions
- Comparable price to non isolated package
- Mounting without isolating bushing and foil