Dear Valued Customer,
Infineon is delighted to welcome you to Mobile World Congress 2010, the world's leading gathering place for the wireless industry, in
Montjuic,
Barcelona from February 15-18, 2010.
This year you will discover our wireless highlights in HALL1, BOOTH B22, just in front of last year’s booth (B19).
Talk to our experts and see how Infineon is redefining the boundaries of wireless communication. We cover all frequency bands to best support your individual application needs across the full spectrum from 2G to 4G. In addition, we are the only provider of a unified ARM11-based hardware and software architecture extending from GPRS to HSPA+.
Our wireless solutions include:
- Award-winning GSM/GPRS baseband chips for the ultra-low-cost mobile phone segment
- 2.5 and 2.75G fully integrated chips for best-in-class performance and cost efficiencies in the entry segment
- Compact ARM11 devices for building competitive HSDPA / WEDGE phones for all 3G market segments
We look forward to welcoming you at our booth.
Sincerely,
Your Infineon Team