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OptiMOS™ and new CoolMOS™ C7 Gold in TOLL package



New 650V CoolMOS™ C7 Gold in TO-Leadless

A new SMD package using Kelvin source concept Infineon's new 650V CoolMOS™ C7 Gold (G7) technology in latest surface mount device (SMD) TO-Leadless (TOLL) package brings together for the first time the benefits of the improved 650V CoolMOS™ C7 Gold technology, 4pin Kelvin source capability and the improved thermal properties of the TOLL package. This enables as SMD solution for high current hard switching topologies such as power factor correction (PFC) up to 3kW.

>Learn more


Customer benefits

TO-Leadless vs. D2PAK
  • Higher efficiency due to the improved CoolMOS™ C7 Gold technology as well as faster switching due to the package low parasitic source inductance and the 4pin Kelvin source concept
  • Improved power density due to low R DS(on) in small footprint by either replacing TO-packages (height restrictions) or paralleling Surface Mount Devices (SMD) packages due to thermal or R DS(on) requirements
  • Production cost reduction by moving to SMD through quicker assembly times



  • 30% footprint reduction
  • 50% height reduction
  • 60% space reduction

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OptiMOS™ in TO-Leadless

Need a small MOSFET to handle 300A? The innovative package for your high current applications with a 30% footprint reduction whilst eliminating electromigration.


High current applications such as Power Tools, Light Electric Vehicles and Fork Lifts often result in MOSFETs being used in parallel, driving up board space and cost - not any longer. Infineon’s TO-Leadless MOSFET package is optimized to handle currents of up to 300A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30% compared to D 2PAK, together with a height reduction of 50%, results in an overall space saving of 60% enabling much more compact designs.


The problem of electromigration is a challenge in high power and high temperature applications as well. Here again TO-Leadless is the ideal package solution. A 50% bigger solder contact area avoids electromigration leading to improvement in reliability. Infineon now offers five voltage classes for OptiMOS™ in TO-Leadless ranging from 30V to 150V.

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Product Portfolio new 650V CoolMOS™ C7 Gold Power MOSFETs in TO-Leadless package

Click on a product type to learn more, download datasheets and order

Package Product type V DS [V] R DS(on) max [mΩ]


650 195


650 105


650 33


Product Portfolio OptiMOS™ Power MOSFETs in TO-Leadless package

Click on a product type to learn more, download datasheets and order

Package Product type V DS [V] R DS(on) max [mΩ]


30 0.4


60 0.7


80 1.2


100 2.0


100 1.5


150 5.9


200 11.1


250 21.0

Power Management Selection Guide 2016


650V CoolMOS™ C7 Gold in TOLL package

A new SMD package using Kelvin source concept

Improved CoolMOS™ C7 Gold technology



TOLL package vs D 2PAK



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Benefits in efficiency TOLL versus TO-247



Performance gain of 0.6 percent full load efficiency gain TOLL versus TO-247 due to lower R DS(on) from TOLL and 4pin Kelvin
source capability. 

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Key features  Key benefits

CoolMOS™ C7 Gold:

  • Gives best-in-class FOM R DS(on) x E oss and R DS(on) x Q G
  • Enables best-in-class R DS(on) in smallest footprint

TOLL package:

  • Inbuilt 4 th pin Kelvin source configuration and low parasitic source inductance (~1nH)
  • Is MSL1 compliant, total Pb-free, hasneasy visual inspection grooved leads
  • Enables improved thermal performance R th
  • FOM R DS(on) x Q G is 14% better than previous 650V CoolMOS™ C7 enabling faster switching leading to higher efficiency
  • Power density through BIC 33mΩ in 115mm² TOLL footprint
  • Reducing parasitic source inductance by Kelvin source improves efficiency switching and ease-of-use
  • TOLL package is easy to use and has the highest quality standards
  • Improved thermals enable SMD TOLL package to be used in higher current designs than has been previously possible

OptiMOS™ in TOLL package

Features Benefits Application
  • Industry‘s lowest R DS(on)
  • Highest current capability up to 300A
  • Very low package parasitics and inductances


  • Less paralleling and cooling required
  • Highest system reliability
  • System cost reduction
  • Enabling very compact design


5kW TO-Leadless Evaluation Board

This reference design is showing the performance of Infineon's Power MOSFET family OptiMOS™ in the new TO-Leadless package in terms of parallelization and thermal behavior.

5 variants available:

  • 60V with IPT007N06N
  • 80V with IPT012N08N5
  • 100V with IPT015N10N5
  • 100V with IPT020N10N3
  • 120V with IPT059N15N3

Learn more



IFX_Website-Button_Webinars Banner Simulation Tool



Product Brief

Title Size Date Version
312 KB 13 Apr 2014 01_00
305 KB 09 May 2016 01_00

Product Selection Guide

Title Size Date Version
21 MB 22 Feb 2016 00_00
521 KB 10 Oct 2016 01_00
264 KB 10 Oct 2016 01_00

Product Brochure

Title Size Date Version
613 KB 27 Apr 2016 03_00
2.7 MB 30 May 2016 02_00
1.5 MB 09 Jun 2016 06_16

Application Notes

Title Size Date Version
4.3 MB 31 Aug 2015 01_03
970 KB 19 Oct 2016 01_01
880 KB 14 Aug 2014
993 KB 01 Apr 2008
356 KB 01 Mar 2009
7 MB 25 Jun 2015 01_00
1 MB 01 Nov 2012
2.5 MB 10 Jun 2016 01_01
654 KB 17 Sep 2013
701 KB 30 Nov 2015 01_00
663 KB 01 Dec 2012

Application Brochure

Title Size Date Version
6.9 MB 01 Jun 2013 00_00
2.1 MB 27 Feb 2014 01_00
1.9 MB 26 Jun 2014 01_00


Title Size Date Version
1.6 MB 08 May 2013
2.2 MB 20 May 2014


Title Size Date Version
699 KB 10 Jun 2015 01_00

Additional Product Information

Title Size Date Version
219 KB 14 May 2013
392 KB 04 Oct 2013
369 KB 21 Mar 2014


Simulation Models

Title Size Date Version
1 MB 18 Oct 2016 01_00



New eLearning: 650V CoolMOS™ C7 Gold and TO-Leadless package

This eLearning will help you to understand how the new 650V C7 Gold technology and the TO-Leadless package features combine together to enable for the first time an SMD package to be used in mid to high power PFC circuit. In this training, you will learn how the new C7 Gold and the TO-Leadless package bring benefits in power density and help saving manufacturing costs.

Length 17:00


TO-Leadless (TOLL): Package for High Current Applications

TO-Leadless (TOLL): Package for High Current Applications

The new TO-Leadless package is optimized for high current applications, such as Forklift, Light Electric Vehicles (LEV), PoL (Point of Load), efuse and Telecom. This new package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.

Length 4:11



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