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New 650V CoolMOS™ C7 Gold in TO-Leadless package (G7 series) features the perfect balance of high efficiency and ease-of-use, enabling for the first time the possibility of using an Surface Mount (or SMD) solution in mid to high
power boost or power factor correction circuits (PFC).

 

ThinPAK 5x6 package, a new leadless SMD package for CoolMOS™, provides 80 percent volume reduction in comparison to traditional SMD packages such as DPAK. Infineon's CoolMOS™ CE in the new TO-220 FullPAK Wide Creepage package offers an extended creepage by increasing the distance between pins to 4.25mm versus the usual 2.54mm of the widely used TO-220 FullPAK package, reducing cost and additional process steps.



Button_Package_Appnotes_175x75 Button_Packing_Information_175x75 Button_Footprints_Outlines_175x75

 

NEW! 650V CoolMOS™ C7 Gold in TO-Leadless package

Power Management Selection Guide 2016



         650V-coolmos-C7-Gold-in-TOLL

New CoolMOS C7 Gold in TO-Leadless package

The perfect balance between efficiency and ease of use

Learn more

TO-220 FP_Wide-Creepage

New 600V CoolMOS™ CE in TO-220 FullPAK Wide Creepage

Improved creepage distance for open frame power supplies

Learn more

 

SOT223-CoolMOS-CE

 

New 500V/600V/650V/700V CoolMOS™ CE in SOT-223

Cost-effective drop-in replacement for DPAK

Learn more

 

 

 

 

Reliability-data-button

IFX_Website-Button_Webinars Banner Simulation Tool

 


Product Selection Guide

Title Size Date Version
521 KB 10 Oct 2016 01_00
298 KB 08 Sep 2016 01_00
310 KB 10 Oct 2016 01_00
21 MB 22 Feb 2016 00_00
264 KB 10 Oct 2016 01_00
211 KB 10 Oct 2016 01_00

Product Brochure

Title Size Date Version
1.2 MB 31 Oct 2016 01_00
1.5 MB 09 Jun 2016 06_16
613 KB 27 Apr 2016 03_00
2.7 MB 30 May 2016 02_00

Product Brief

Title Size Date Version
225 KB 17 Jan 2017 01_00
934 KB 04 Oct 2016 01_00
653 KB 03 Dec 2014 01_00
132 KB 23 Dec 2016 01_00
409 KB 03 Jul 2015 01_00
386 KB 16 Sep 2015 02_00
590 KB 17 Nov 2016 01_00
200 KB 25 Apr 2016 01_00
573 KB 04 Oct 2016 01_00
305 KB 09 May 2016 01_00
117 KB 23 Dec 2016 01_00
166 KB 11 Mar 2016 01_00
312 KB 13 Apr 2014 01_00
518 KB 07 Aug 2013
234 KB 28 Apr 2014
283 KB 01 Apr 2010
738 KB 01 Nov 2012

Application Brochure

Title Size Date Version
6.9 MB 01 Jun 2013 00_00
1.9 MB 26 Jun 2014 01_00
2.1 MB 27 Feb 2014 01_00

Application Notes

Title Size Date Version
1.5 MB 07 Nov 2016 02_00
2.5 MB 10 Jun 2016 01_01
1 MB 01 Nov 2012
2 MB 01 Dec 2016 01_00
660 KB 23 Nov 2015 01_00
902 KB 13 Aug 2013 01_00
1 MB 10 Jan 2017 01_00
7 MB 25 Jun 2015 01_00
773 KB 24 Feb 2016 01_00
1.2 MB 01 Jun 2012
880 KB 14 Aug 2014
1.4 MB 16 Nov 2015 01_00
970 KB 19 Oct 2016 01_01
654 KB 17 Sep 2013
1.5 MB 17 Sep 2013
794 KB 03 May 2013
1.5 MB 12 May 2014
480 KB 01 Apr 2012
4.3 MB 12 Dec 2013
663 KB 01 Dec 2012
701 KB 30 Nov 2015 01_00
1.1 MB 01 Mar 2011
934 KB 01 Mar 2011
993 KB 01 Apr 2008
1.6 MB 23 Apr 2008 01_00
523 KB 08 May 2013

Article

Title Size Date Version
699 KB 10 Jun 2015 01_00
1.7 MB 20 Oct 2014 01_00

Presentations

Title Size Date Version
3.2 MB 04 Nov 2016 01_00
1.7 MB 04 Nov 2016 01_00
2.1 MB 04 Nov 2016 01_00
1.6 MB 08 May 2013
2.6 MB 04 Nov 2016 01_00
2.2 MB 20 May 2014

Additional Product Information

Title Size Date Version
105 KB 06 May 2013
157 KB 12 Mar 2015 01_00
392 KB 04 Oct 2013
94 KB 14 May 2014
97 KB 14 May 2014
114 KB 01 Mar 2013 01_00

Evaluation Boards

Board Family Description Status
EVAL_40W_19V_FLYB_P7 MOSFET, Power Controller (PWM, PFC) Test platform for low cost charger and adapter applications
  • 2N7002
  • ICE2QS03G
  • IPA70R600P7S
coming soon

Simulation Models

Title Size Date Version
666 KB 18 Aug 2016 01_00
669 KB 14 Mar 2014 02_00
667 KB 07 Mar 2013 02_00
7 KB 30 Sep 2015 01_00
668 KB 07 Mar 2013 01_00
667 KB 07 Mar 2013 01_00
669 KB 18 Aug 2016 01_00
671 KB 31 Jul 2014 01_00
666 KB 29 Apr 2016 01_00
668 KB 07 Mar 2013 01_00
666 KB 07 Mar 2013 01_00
667 KB 07 Mar 2013 01_00
668 KB 07 Jul 2014 01_00
668 KB 19 Apr 2013 01_00
669 KB 07 Mar 2013 01_00
667 KB 07 Mar 2013 01_00
669 KB 25 Jul 2016 01_00
667 KB 29 Apr 2015 02_00
1.1 MB 02 Nov 2016 01_00
668 KB 07 Mar 2013 01_00
665 KB 07 Mar 2013 01_00
667 KB 15 May 2013 01_00
667 KB 07 Mar 2013 01_00
667 KB 07 Sep 2016 01_00
650V-Coolmos-C7-Gold-Toll-eLearning 

New eLearning: 650V CoolMOS™ C7 Gold and TO-Leadless package

This eLearning will help you to understand how the new 650V C7 Gold technology and the TO-Leadless package features combine together to enable for the first time an SMD package to be used in mid to high power PFC circuit. In this training, you will learn how the new C7 Gold and the TO-Leadless package bring benefits in power density and help saving manufacturing costs.

 
Length 17:00

 

 

CoolMOS™ in ThinPAK 5x6

CoolMOS™ in ThinPAK 5x6

ThinPAK 5x6 is a leadless SMD package especially designed for High Voltage MOSFETs. This new package has a very small footprint of 5x6mm² and a very low profile with only 1mm height. The package enables faster and more effcient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.

 
Length 3:54
TO-Leadless (TOLL): Package for High Current Applications

TO-Leadless (TOLL): Package for High Current Applications

The new TO-Leadless package is optimized for high current applications, such as Forklift, Light Electric Vehicles (LEV), PoL (Point of Load), efuse and Telecom. This new package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.

 
Length 4:11

 

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