Power modules with integrated Driver Electronics
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MIPAQ™ modules are designed to enable system cost savings by integrating features such as temperature and current measurement as well as driver electronics. The MIPAQ™ module portfolio consists of MIPAQ™ serve, MIPAQ™ base and MIPAQ™ Pro.
Our MIPAQ™ base modules are available as IGBT sixpack or IGBT half bridge configuration including PressFIT pins and integrated shunts for exact current measurement.
The MIPAQ™ Pro is a fully qualified and tested IPM, integrating IGBTs, gate driver, heat sink, sensors, digital control electronics as well as digital bus communication. MIPAQ™ serve is an IGBT module in a sixpack configuration with integrated driver electronics and digital temperature measurement. An integrated driver provides several protection features as well as galvanic isolation using Infineon's Coreless Transformer Technology.
The combination of an IGBT module and integrated sensing and driving electronics leads to an optimized solution in mastering the challenge of designing powerful and compact inverters for low and medium power. It eases the cost situation on the one hand and contributes to energy saving on the other hand.
MIPAQ™ serve comes with the EconoPACK™ 4 package and the latest IGBT4 chip technology. It covers the 1200V range and manages currents of 100A, 150A and 200A. The supply voltages and logic signals are transferred through standardized connectors while the power connections are established with M6-sized screws. All integrated features are fully tested and reliable operation is ensured. These functionalities make MIPAQ™ serve a full plug-and-play solution for various applications. No time needs to be spent designing and testing the driver circuit - this significantly shortens time-to-market of new products!
MIPAQ™ Pro intelligent power module (IPM) is a fully qualified and tested IPM integrating IGBTs, gate drivers, a heat sink, sensors, digital control electronics as well as digital bus communication. It comes in a half-bridge configuration with blocking voltages of 1200 V and 1700 V. Discover a new Dimension of Smart Protection
Thermal Interface Material (TIM)
TIM is the abbreviation for Infineon`s new Thermal Interface Material. With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge. Further information, such as articles, editorials and application notes are available.
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|2.2 MB||03 Dec 2015||01_02|
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|MA040E12||IGBT Modules||Evaluation board containing an isolated gate driver power supply and logic interface for MIPAQ™ serve.
|MA3AE12||IGBT Modules||Isolating amplifier for current measurement with MIPAQ™ base up to 1200V.
|2.7 MB||28 Jul 2016||07_08|
A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.
Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.
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