Infineon's TO-220 FullPAK Wide Creepage package offers an extended creepage by increasing the distance between pins to 4.25mm versus the usual 2.54mm of the widely used TO-220 FullPAK package. This package targets open frame power supplies such as TV sets and PC power where dust can enter the case through air vents. Dust particles can reduce the effective creepage between pins over time which may lead to high voltage arcing.
The TO-220 FullPAK Wide Creepage package meets the requirements of open frame power supplies without additional measures. Thus, it reduces system cost by offering an alternative to frequently used approaches to increase creepage distance: silicon potting, the usage of sleeves, pre-bending of leads and other workarounds come at an extra cost of an estimated 2-5 USD cents. This cost and the additional process steps can be removed with the wide creepage package.
Package comparison - reduce cost and additional process steps
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