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OptiMOS™ in TOLL package



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Need a small MOSFET to handle 300A? The innovative package for your high current applications with a 30% footprint reduction whilst eliminating electromigration.


High current applications such as power tools, light electric vehicles and fork lifts often result in MOSFETs being used in parallel, driving up board space and cost - not any longer. Infineon’s TO-Leadless MOSFET package is optimized to handle currents of up to 300A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30% compared to D 2PAK, together with a height reduction of 50%, results in an overall space saving of 60% enabling much more compact designs.


The problem of electromigration is a challenge in high power and high temperature applications as well. Here again TO-Leadless is the ideal package solution. A 50% bigger solder contact area avoids electromigration leading to improvement in reliability. Infineon now offers five voltage classes for OptiMOS™ in TO-Leadless ranging from 30V to 150V.


Features Benefits Application
  • Industry‘s lowest R DS(on)
  • Highest current capability up to 300A
  • Very low package parasitics and inductances


  • Less paralleling and cooling required
  • Highest system reliability
  • System cost reduction
  • Enabling very compact design


5kW TO-Leadless evaluation board

This evaluation board is showing the performance of Infineon's power MOSFET family OptiMOS™ in the new TO-Leadless package in terms of parallelization and thermal behavior.

5 variants available:

  • 60V with IPT007N06N
  • 80V with IPT012N08N5
  • 100V with IPT015N10N5
  • 100V with IPT020N10N3
  • 120V with IPT059N15N3

Learn more


Product portfolio OptiMOS™ power MOSFETs in TO-Leadless package

Click on a product type to learn more, download datasheets and order

Package Product type V DS [V] R DS(on) max [mΩ]


30 0.4


60 0.7


60 1.2


80 1.2


100 1.5


100 2.0


80 2.9


150 5.9


200 11.1


250 21.0

*Evaluation board available:  5kW TO-leadless board

Product Brief

Title Size Date Version
312 KB 13 Apr 2014 01_00

Product Selection Guide

Title Size Date Version
1.2 MB 17 Aug 2015 01_00
22.2 MB 21 Feb 2017 00_00
310 KB 10 Oct 2016 01_00
521 KB 10 Oct 2016 01_00

Application Notes

Title Size Date Version
2 MB 01 Dec 2016 01_00
7 MB 25 Jun 2015 01_00
970 KB 19 Oct 2016 01_01
902 KB 13 Aug 2013 01_00
880 KB 14 Aug 2014
993 KB 01 Apr 2008
2.5 MB 10 Jun 2016 01_01
654 KB 17 Sep 2013
701 KB 30 Nov 2015 01_00
663 KB 01 Dec 2012

Application Brochure

Title Size Date Version
2.1 MB 27 Feb 2014 01_00


Title Size Date Version
1.6 MB 08 May 2013
2.2 MB 20 May 2014


Title Size Date Version
699 KB 10 Jun 2015 01_00

Additional Product Information

Title Size Date Version
219 KB 14 May 2013
392 KB 04 Oct 2013
369 KB 21 Mar 2014

Simulation Models

Title Size Date Version
1.1 MB 02 Nov 2016 01_00
TO-Leadless (TOLL): Package for High Current Applications

TO-Leadless (TOLL): package for high current applications

The new TO-Leadless package is optimized for high current applications, such as forklift, light electric vehicles (LEV), POL (point-of-load), e-fuse and telecom. This new package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.

Length 4:11


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