TRENCHSTOP™ in TO-247PLUS Package

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Maximum Flexibility in High Power 600V Designs

Header_TO-247PLUS_Header_WEB

 

35% bigger thermal pad area, up to 20% lower Rth, extended creepage of 4.25mm, 160A DC collector current

What are the advantages of 100A and 120A IGBT co-packed with full rated diode in JEDEC standard TO-247PLUS?
The advantages are multiple, depending on the need – power output or power density increase, size and cost reduction, better thermal performance, higher reliability and longer lifetime.

 

Easy upgrade of the available designs for higher power output.
One-to-one replacement of 75A IGBT with 120A device allows up to 40% power output increase keeping the same footprint and thermal conditions.

 

Increased system power density, reducing the PCB footprint, reducing the cost.
Keeping nominal current I c in the system the same, 3 pieces of 75A IGBT in TO-247 can be replaced with 2 pieces of 120A IGBT in TO-247PLUS.

 

Improved thermal conditions for higher reliability and longer lifetime of the IGBT.
35% bigger thermal pad area of TO-247PLUS contributes to 10% -15% better heat dissipation allowing lower junction temperature T jMaximize flexibility of your design with the new TRENCHSTOP™ in TO-247PLUS package.


Product Portfolio TRENCHSTOP™ in TO-247PLUS

Click on a product type to learn more, download datasheet and order

Continuous Current I c
T c = 100°C
Application
Industrial Automotive
100A IKQ100N60T IKQ100N60TA
120A IKQ120N60T IKQ120N60TA


Major Differences - TO-247 and TO-247PLUS

TO-247   TO-247PLUS
TO-247_Front_Back-WEB
  • Screw hole vs. no screw hole
  • Maximum allowable chip area in single die ∼70mm² vs 120mm²
  • Current capability (DuoPAK) 600V: 75A vs 120A (+60%)
  • Increased creepage by 52% to 4.25mm
  • Bond wire limit increased from 80A to 160A
  • Bigger backside active thermal pad area due to missing hole 140mm² vs 190mm²
    • 20% lower thermal resistance R th (jh)
    • 10%-15% better heat dissipation
TO-247PLUS_Front_Back-WEB

Features Benefits Applications
  • Highest current rating co-pack 600V in 100A and 120A
  • Extended creepage distance of 4.25mm
  • 20% lower thermal resistance vs TO-247
  • Higher system power density – I c increase keeping the same system thermal performance
  • Lower thermal resistance R th(jh) and improved by ~15% heat dissipation capability of TO-247PLUS vs TO-247
  • Higher reliability, extended lifetime of the device

 


Product Selection Guide

Title Size Date Version
3.5 MB 16 Mar 2017 01_00
989 KB 12 Apr 2016 00_00
22.2 MB 21 Feb 2017 00_00

Product Catalogue

Title Size Date Version
4.8 MB 21 Jun 2016 02_00

Product Brief

Title Size Date Version
658 KB 23 Nov 2014 01_00

Application Notes

Title Size Date Version
1.7 MB 14 Oct 2016 02_00
958 KB 24 Nov 2014 01_00

Additional Product Information

Title Size Date Version
478 KB 27 Apr 2016 01_00
94 KB 24 Nov 2014 01_00

Simulation Models

Title Size Date Version
6 KB 11 Jul 2013 01_00
6 KB 11 Jul 2013 01_00
Discrete IGBT in TO-247PLUS - Assembly Details and Further Technical Remarks Part1

Discrete IGBT in TO-247PLUS - Assembly Details and Further Technical Remarks Part1

TO-247PLUS is the new Package introduced by Infineon to accommodate more silicone and to have higher current capability than the Industry JEDEC Standard TO-247. It allows higher power dissipation than standard TO-247 and it dramatically reduces the component footprint on the heatsink respect to a standard TO-264.

 
Length 2:39

 

Discrete IGBT in TO-247PLUS - Assembly Details and Further Technical Remarks Part2

Discrete IGBT in TO-247PLUS - Assembly Details and Further Technical Remarks Part2

TO-247PLUS is the new Package introduced by Infineon to accommodate more silicone and to have higher current capability than the Industry JEDEC Standard TO-247. It allows higher power dissipation than standard TO-247 and it dramatically reduces the component footprint on the heatsink respect to a standard TO-264.

 
Length 4:54

 

Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part1

Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part1

TO-247PLUS is intended to be mounted using clips or mechanical pressure systems. Thanks to the improved thermal performance Rth(jh) respect to standard TO-247, even using the same silicon dice than in a Standard TO-247, customers can reach higher current levels at the same junction temperature or getting lower junction temperature at the same collector 

 
Length 3:22

 

Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part2

Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part2

TO-247PLUS is intended to be mounted using clips or mechanical pressure systems. Thanks to the improved thermal performance Rth(jh) respect to standard TO-247, even using the same silicon dice than in a Standard TO-247, customers can reach higher current levels at the same junction temperature or getting lower junction temperature at the same collector 

 
Length 4:05

 

Discrete IGBT in TO-247PLUS Target Applications

Discrete IGBT in TO-247PLUS Target Applications

TO-247PLUS discrete IGBT can be used to increase the power density of the design, increasing system nominal current. 100A or 120A are possible to improve thermal conditions - reducing junction temperature - up to 25% Tcase reduction as lower cost alternative to IGBT modules - up 50% component cost reduction. Higher flexibility of design, lower replacement costs. TO-247PLUS is pressure mounting (clip mounting) package for high power IGBT applications. The standard TO-247 package body has been taken and an extra, 4th pin, has been added to enable the Kelvin Emitter configuration.

 
Length 1:53

 

Discrete IGBT in TO-247PLUS Features and Benefits

Discrete IGBT in TO-247PLUS Features and Benefits

TO-247PLUS package has the same dimensions as standard TO-247, but accomodates as much as 100A and 120A duopack IGBT can. Due to bigger thermal pad area the TO-247PLUS package has lower package thermal resistance, better heat dissipation capabilities.

 
Length 2:34

 

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