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New TO-247 4pin Kelvin Emitter Package for Discrete IGBTs

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The new TO-247 4pin Kelvin Emitter package addresses the need for increased power density and space saving in applications striving for high efficiency. Infineon's new TO-247PLUS package for high power applications enables up to 120A IGBT co-packed with a full rated diode in the same footprint and pin-out as JEDEC standard TO-247.

 

Latest Discrete Packages subcategories


600V & 1200V IGBT in TO-247PLUS 3pin Package 650V & 1200V IGBT in TO-247 4pin and TO-247PLUS 4pin Package


Latest Innovations

TRENCHSTOP™ Advanced Isolation  

New TRENCHSTOP™ Advanced Isolation

The new TRENCHSTOP™ Advanced Isolation represent the cutting-edge technology in isolated packages. 35% lower thermal resistance R th(j-h) of advance isolation material compared to high grade Iso-foil enables effective and reliable thermal path from chip to the heatsink.
Up to 10°C lower case temperature T c and up to 20% higher power output P out  is possible when replacing TO-247 and standard isolation foil with the new fully isolated Advanced Isolation TO-247 package.

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Button IGBT Discretes Selection Guide 175x75 IFX_Website-Button_Webinars Reliability-data-button Banner_Simulation_Models_IGBT

 



TRENCHSTOP™ 5 TO-247 4pin Kelvin Emitter Package -  r edefining new levels of switching losses and power density

When used in combination with Rapid Diode technologies, the innovative TO-247 4pin package provides efficiency levels previously not available. Applications such as Uninterruptible Power Supplies (UPS), Data Centers, and Telecommunications equipment, with PFC and inverter stages switching at greater than 20kHz will profit from the new package. 

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Discrete IGBT in TO-247PLUS Package - maximum flexibility in high power 600V designs

The TO-247PLUS can be used in industrial applications such as UPS, Welding, Solar, Industrial Drives as well as Automotive applications such as Powertrain Inverter to upgrade existing designs for higher power output or to improve the thermal conditions in the application consequently improving the system reliability and lifetime.

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Product Selection Guide

Title Size Date Version
3.5 MB 15 May 2017 01_00
989 KB 12 Apr 2016 00_00
22.2 MB 21 Feb 2017 00_00
343 KB 06 Apr 2016 00_01

Product Catalogue

Title Size Date Version
2.9 MB 12 May 2017 03_00

Product Brief

Title Size Date Version
191 KB 28 Apr 2017 01_00
658 KB 23 Nov 2014 01_00
368 KB 14 May 2017 01_00
592 KB 04 Nov 2014 01_00

Application Notes

Title Size Date Version
1.7 MB 14 Oct 2016 02_00
1.1 MB 10 Feb 2017 02_00
1.1 MB 04 Nov 2014 01_00

Additional Product Information

Title Size Date Version
474 KB 16 May 2017 02_00
97 KB 28 Jan 2015 01_00
94 KB 24 Nov 2014 01_00
168 KB 04 Nov 2014 01_00

Product Presentation

Title Size Date Version
1.6 MB 14 May 2017 01_00

Simulation Models

Title Size Date Version
6 KB 11 Jul 2013 01_00
6 KB 11 Jul 2013 01_00
TRENCHSTOP™ 5 in TO-247 4pin Package - Portfolio Overview

TRENCHSTOP™ 5 in TO-247 4pin Package - Portfolio Overview

This video will provide you information about the best in class performance of the TRENCHSTOP™ 5 IGBT technology. Infineon offers the technology in a high power package with an extra Kelvin Emitter pin. The standard TO-247 package body has been taken and an extra, 4th pin, has been added to enable the Kelvin Sense configuration.

 
Length 3:24
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board - Board Description And Purpose

TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board - Board Description And Purpose

This video gives a general introduction of the TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board. It explains the main features and components as well as the delivery scope.

 
Length 3:23
Discrete IGBT in TO-247PLUS Target Applications

Discrete IGBT in TO-247PLUS Target Applications

TO-247PLUS discrete IGBT can be used to increase the power density of the design, increasing system nominal current. 100A or 120A are possible to improve thermal conditions - reducing junction temperature - up to 25% Tcase reduction as lower cost alternative to IGBT modules - up 50% component cost reduction. Higher flexibility of design, lower replacement costs. TO-247PLUS is pressure mounting (clip mounting) package for high power IGBT applications. The standard TO-247 package body has been taken and an extra, 4th pin, has been added to enable the Kelvin Emitter configuration.

 
Length 1:53
Discrete IGBT in TO-247PLUS - Assembly Details and Further Technical Remarks Part1

Discrete IGBT in TO-247PLUS - Assembly Details and Further Technical Remarks Part1

TO-247PLUS is the new Package introduced by Infineon to accommodate more silicone and to have higher current capability than the Industry JEDEC Standard TO-247. It allows higher power dissipation than standard TO-247 and it dramatically reduces the component footprint on the heatsink respect to a standard TO-264.

 
Length 2:39

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