SmartPIM and SmartPACK

This module family provides all reliability characteristics known from the established PressFIT technology and comes up with advanced features:

• Press in process by tightening the module 
• Flexible mounting possibilities;
• The new module and mounting concept reduces process time;
• Robust housing concept with decoupled DCB force;
• Gas tight contact so no climate sequence has a negative effect;
• Decreased FIT-rates for interconnections;
• Reliable cold welded connection of module pins and PCB;
• Mounting possible on both sides of standard PCBs 

These new SmartPIM1 and SmartPACK1 are the starters of an entirely new product family followed by SmartPIM2, SmartPACK2, SmartPIM3 and SmartPACK3. The complete housing family will follow the same mounting process and cover a possible current range up to 200A distributed over the different housing sizes.