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As a recognized technology leader in IGBT, Infineon offers a comprehensive portfolio in different voltage- and current classes. IGBT products are offered as bare dies, discretes components, power modules and even complete stack solutions.

Latest Innovations



Infineon’s new 650V TRENCHSTOP™ S5 family, optimized for applications such as Photovoltaic Inverters and UPS, delivers increased levels of robustness and quality to aid end customers in achieving up to 20 years of operational lifetime. Overall, the IGBT provides customers with improved efficiency, price competitiveness, and robustness. Read more about our new TRENCHSTOP  5 S5 family.


General description of our IGBT portfolio

IGBT bare dies are silicon based IGBT chips. Infineon supports bare die and wafer solutions for module manufacturers enabling higher levels of integration, power density and board space reduction. Furthermore, Infineon offers a broad portfolio of IGBT chips assembled in discrete plastic packages, so called Discretes IGBTs, which are available as Single IGBTs and co-packed with freewheeling Diode. This devices are suitable for applications such as General Purpose Inverters, Solar Inverters, UPS, Induction Heating, Major Home Appliances, Welding and SMPS. Benefits of Discretes IGBT are high current density and low power dissipation resulting in higher efficiency and smaller heat sink to allow lower overall system cost.

Larger arrangements that form basic building blocks of power electronic equipment are considered Power Modules usually combining IGBT and diode dies in various topologies. Ready-to-use assembled stacks are configured to cope with the needs of highest power applications. These stacks, often referred to as Systems, are built on IGBT power modules or discs, depending on the field of application. From all-in-one power integrated modules with rectifier, brake chopper and inverter part to highest power Stack assemblies, Infineon products cover a range from only hundreds of watts to several megawatts. General purpose drives, servo-units and renewable energy applications like solar inverters or wind applications benefit from the outstanding performance, efficiency and longevity of these highly reliable products.

The HybridPACK™ family as a special product series with automotive qualification is available to support the designer's efforts in electric mobility. Infineon further supports the automotive industry, providing a variety of discrete IGBT power semiconductors qualified according to AECQ101.

To ease setting up a laboratory experiment or a first prototype, Infineon helps by providing evaluation boards for most of the products to accelerate development cycles. Thus, conclusive results can be generated within the shortest possible time.


Highpower Thyristors & Diodes   EiceDRIVER™   MIPAQ™ Pro

New! Discrete IGBT family TRENCHSTOP™ 5 S5

Shortform Catalog




IPOSIM - Power Simulation








MIPAQ™ Pro intelligent power module (IPM) is a fully qualified and tested IPM integrating IGBTs, gate drivers, a heat sink, sensors, digital control electronics as well as digital bus communication. It comes in a half-bridge configuration with blocking voltages of 1200 V and 1700 V. Discover a new Dimension of Smart Protection





XHP™ - FleXible High-Power Platform

The new housing for high-power IGBT modules is designed to cover the full-voltage range of IGBT chips from 3.3 to 6.5 kV. Principle applications of the new package are expected in industrial drives, traction, renewable energy and power transmission applications. Discover more about our XHP


Product image PrimePACK3  



PrimePACK™ IGBT Modules

The well-known PrimePACK™ IGBT half-bridge and chopper modules with internal NTC offer a specially optimized concept for the integration in high power inverters like windpower units, industrial- and traction inverters, commercial / construction and agriculture vehicles and other applications. More about our PrimePACK TM IGBT Modules


PrimePACK™ with TIM  


Thermal Interface Material (TIM)

TIM is the abbreviation for Infineon`s new Thermal Interface Material. With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge. Further information, such as articles, editorials and application notes are available.


SmartPIM 2  




Smart Power Modules

This module family provides all reliability characteristics known from the established PressFIT technology and comes up with advanced features. The complete housing family will follow the same mounting process and cover a possible current range up to 200 A distributed over the different housing sizes. Read more about our Smart Power Modules




Product image Easy 2B - Pressfit - blank  

Modules for Photo-voltaic String and Multi-String Inverters

Tailor-made modules for photo-voltaic string and multi-string inverters. Optimised inverter efficiency and performance can be achieved. Fast and solder-less assembly is possible using the proven PressFIT technology. Read more about our modules for Photo-voltaic String and Multi-String Inverters


Silicon Carbide (SiC)

Power modules available with Silicon Carbide (SiC) diodes and transistors. These key components for modern and innovative power electronic solutions aim for the highest power density and efficiency. Those targets can be achieved by using the chips as stand-alone components or in combination with silicon power devices in power modules. Find out more about our SiC Modules




Product image 2ED300C17-S_2  




EiceDRIVER™ - Gate Driver ICs and Boards

Highly reliable solutions for driving MOSFETs, IGBTs and IGBT modules which enable our customers to build reliable and efficient applications. Discover our broad spectrum of optimized low and high voltage gate driver ICs and boards


Product image 2ED020I12FA  



Automotive EiceDRIVER™

The Infineon EiceDRIVER™ family includes single and dual channel automotive IGBT Driver IC’s providing galvanic isolation and bidirectional signal transmission with high ambient temperature capability. Find out more about our Automotive EiceDRIVER™


Product image P-IG-IHM_B ifx  

IHM / IHV IGBT modules B-series

The well known IHM (IGBT High-Power Modules) & IHV (IGBT High-Voltage Modules) are robust and work with supreme reliability at any temperature condition from -40/-50°C up to +150°C. IHM-B/IHV-B are offered in a range of 500 A to 3600 A at 1200 V to 4,5 kV, which enables them through different topologies (half-bridge-, single switch-, chopper- and diode modules) to be used in various high power inverter sizes. Read more about our IHM / IHV IGBT modules B-series


3.3 kV modules in IHV housing

The IHM/IHV product group covers all possible inverter power sizes as single switch, half-bridge-, chopper and diode modules. More about our 3.3 kV modules in IHV portfolio


Product image P-IG-IHV-H_IH12 ifx  

4.5kV Modules in IHV housing

The 4,5 kV trench plus Field stop IGBT and Field stop diode chips fill the gap between the voltage classes of 3.3 kV and 6.5 kV IGBT modules. More about our 4.5 kV modules


6.5 kV Modules in IHV housing

New RCDC technology introduced to address customers’ demand of high power density, efficiency, long lifecycle, reliability, improved temperature behavior and reduced systems costs in high voltage applications. It combines IGBT and diode function in one chip. IHV housing established a standard for high power IGBT modules which was used in countless applications all over the world. Read more about our 6.5 kV IGBT modules


Product image 34mm  



34 mm & 62 mm IGBT Modules

Flexibility, optimal electrical performance and highest reliability. These are the keywords for a successful inverter layout. The 34 mm and 62 mm product family of Half Bridges and Single Switches with the state-of-the-art IGBT4 Chip Technology perfectly fits into modern inverter concepts for all kinds of applications. Our well-known 34 and 62 mm modules are the right choice for your design.


Product image EconoPACK +_OEx  



EconoPACK™+ D-series

The innovative EconoPACK™+ D-series takes care of reliable and solderless press-in contacts with PressFIT auxiliary terminals. The PressFIT contacts provide also the flexibility for a solder process, if required. The D-series is focused on a rugged and robust module design by injected molded control and power terminals and ultrasonic welded power terminals. Make the next step with the EconoPACK™+ D-series


Product image EconoPACK 4  


EconoPIM™/ EconoPACK™ 650V IGBT 4

The new 650V IGBT4-E4 is an optimized chip version designed with respect to the application needs. The new device features an improved softness during switch-off and as a result of the soft turn-off a reduced EMI effort. Read more about our EconoPIM™/ EconoPACK™ 650V IGBT 4


EconoPACK™ 4 IGBT Modules

The EconoPACK™ 4 package perfectly fits into the well-known Econo portfolio. EconoPACK™ 4 features screw power terminal, providing excellent electric connection. DC and AC link are separated and distinguishable at one glance for ease of use. More about our EconoPACK™ 4 IGBT Modules


Product image EconoDUAL 3  



EconoDUAL™ 3 650V/ 1200V/ 1700V 600A

Infineon offers the well-established EconoDUAL™ 3 series. Our contribution to your success are new advanced assembly technologies, superb thermal performances to enable full power utilization, Plug and play upgrades of existing inverter designs and PressFIT and solder pin versions. Best in class: EconoDUAL 3 650V/ 1200V/ 1700V 600A



Application Brochure

Title Size Date Version
2 MB 11 May 2015 08_00
340 KB 23 Oct 2015 01_00

Product Family Overview

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1.3 MB 18 Feb 2014
501 KB 10 May 2010
856 KB 09 Nov 2012

Application Notes

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1.1 MB 09 Apr 2009
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887 KB 07 Aug 2012
1.2 MB 13 Nov 2015 01_00
307 KB 09 Apr 2009
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2.3 MB 12 Nov 2012
428 KB 09 Apr 2009
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1.4 MB 19 Jun 2004
1.1 MB 04 Nov 2014 01_00
724 KB 09 Apr 2009
1.6 MB 01 Oct 2015 01_00
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Product Selection Guide

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325 KB 14 Apr 2015 01_00
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375 KB 16 Nov 2012
432 KB 01 Oct 2014

Product Catalogue

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29.9 MB 30 Apr 2015 01_00


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Product Brief

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302 KB 28 Apr 2014
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501 KB 18 Oct 2012
454 KB 04 Jun 2013
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Product Brochure

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1.7 MB 11 May 2015 07_00

Additional Product Information

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474 KB 08 Sep 2015 01_00


Evaluation Boards

Board Family Description Status
EVAL-2EDL23I06PJ Isolated Gate Driver IC, Discrete IGBT with Anti-Parallel Diode Evaluation Board for 2EDL23I06PJ - Optimized 600V half bridge gate driver IC with LS-SOI technology to control THT Highspeed3-IGBT IKP20N60H3 in TO220 package
  • 2EDL23I06PJ
  • IKP20N60H3
active and preferred
EVAL-6EDL04I06PT Isolated Gate Driver IC, Discrete IGBT with Anti-Parallel Diode Evaluation Board for 6EDL04I06PT - Full bridge 3 Phase gate driver IC with LS-SOI technology to control power devices like MOS-transistors or 600V IGBTs
  • 6EDL04I06PT
active and preferred
EVAL-IGBT-650V-TO247-4 Discrete IGBT without Anti-Parallel Diode, Isolated Gate Driver IC, TRENCHSTOP™ 5 in TO-247 4pin Package, IGBT Discretes with Anti-Parallel Diode 600V-1600V, 650V TRENCHSTOP™ 5 Adaptable double pulse tester for IGBTs in TO-247 4pin package
  • IGP40N65H5
  • IKZ50N65NH5
  • IKW50N65H5
  • 1EDI60I12AF
active and preferred
KP EXTENSION BOARD Integrated Automotive Pressure Sensors, Manifold Pressure and Barometric Pressure KP21x sensor stick with internal KP215 sensor. The KP MAP/ BAP evaluation board is an easy and ready to use tool to discover the capabilities of the Infineon KP pressure sensor family. The required software and promotional material is included in the integrated memory stick and can be downloaded right away. All features are implemented in a USB stick with a graphical user interface to manipulate and evaluate the sensor behavior. active and preferred


Simulation Models

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3.4 MB 18 Mar 2014
4 KB 11 Jul 2013 02_06
3 KB 26 Jul 2007 01_00
9 KB 11 Jul 2013
8 KB 16 Jul 2013 01_00
5 KB 11 Jul 2013 02_06
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7 KB 11 Jul 2013 00_05
10 KB 11 Jul 2013 01_00
14 KB 03 Jan 2013
6 KB 11 Jul 2013 01_00
9 KB 09 Oct 2015 01_00
7 KB 11 Jul 2013 03_00
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7 KB 11 Jul 2013 03_00
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5 KB 11 Jul 2013 03_05
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Low VCE(sat) Optimized TRENCHSTOP™ 5 L5

TRENCHSTOP™ 5 Soft Hard Switching “S5” Introduction

Brief introduction into the key values and customer benefits of the new TRENCHSTOP™ S5 Family

Length 2:42


XHP™ - Infineon´s new flexible high power platform

XHP™ - Infineon´s new flexible high power platform

Get an first impression how XHP™ will boost your system. This video explain how you can reach the next level of flexibility with Infineon´s new high power platform.

Length 4:36


Thermal Interface Material

Thermal Interface Material

A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

Length 1:48


EiceDRIVER™ 2EDL Driver IC Family

EiceDRIVER™ 2EDL Driver IC Family

EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 

Length 9:21


TRENCHSTOP™ 5 - Portfolio and Summary

TRENCHSTOP™ 5 - Portfolio and Summary

The new 650V TRENCHSTOP™5 IGBT technology from Infineon redefines the “Best-in-Class IGBT” by providing unmatched performance in terms of efficiency. When high efficiency, lower system costs and increased reliability are demanded, 650V TRENCHSTOP™5 is the only option. The new TRENCHSTOP™5 IGBTs deliver a dramatic reduction in switching and conduction losses for PFC and PWM topologies in applications such as Welding, Uninterruptible Power Supply and Solar. 650V TRENCHSTOPTM5 is available in two variants, HighSpeed 5 (H5) for high speed and HighSpeed5 Fast (F5) for highest efficiency.

Length 2:39


Low VCE(sat) Optimized TRENCHSTOP™ 5 L5

Low VCE(sat) Optimized TRENCHSTOP™ 5 L5

The TRENCHSTOP™ 5 family L5 with low saturation voltage VCE(sat) is optimized for polarity switches at switching frequencies of 50kHz-20kHz. The intrinsically low conduction losses of the 55µm TRENCHSTOP™ 5 thin wafer technology have been reduced further with additional optimization of the carrier profile.

Length 2:42


Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part1

Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part1

TO-247PLUS is intended to be mounted using clips or mechanical pressure systems. Thanks to the improved thermal performance Rth(jh) respect to standard TO-247, even using the same silicon dice than in a Standard TO-247, customers can reach higher current levels at the same junction temperature or getting lower junction temperature at the same collector 

Length 3:22


TRENCHSTOP™ 5 IGBTs in Kelvine Emitter Configuration - Benefits of TRENCHSTOP™ 5 in TO-247 4pin

TRENCHSTOP™ 5 IGBTs in Kelvine Emitter Configuration - Benefits of TRENCHSTOP™ 5 in TO-247 4pin

This video will provide you information about the best in class performance of the TRENCHSTOP™5 IGBT technology. Infineon offers the technology in a high power package with an extra Kelvin Emitter pin. 

Length 2:06


RC-H5 The Next Generation Reverse Conduction IGBT Part 1 of 2

RC-H5 The Next Generation Reverse Conduction IGBT Part 1 of 2

The latest generation of reverse conducting IGBTs has been optimized for the demanding requirements of Induction Cooking applications. RC-H5 offers up to 30% reduction in switching losses, allowing designers to use higher frequencies.

Length 9:21


PressFit Technology

PressFit Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Length 3:00


Infineon’s New 4.5kV IHV IGBT

Infineon’s New 4.5kV IHV IGBT

The new 4.5kV IGBT modules are optimized for use in traction drives and high-voltage DC transmission systems.

Length 4:19


Power Conversion EN

Power Conversion EN

Infineon provides a comprehensive portfolio of high-power products for Power Conversion, to help its customers to achieve their aims. These high-performance products boost the reliability and efficiency of inverters for photovoltaic or wind applications.

Length 2:02


Advanced Transmission & Distribution EN

Advanced Transmission & Distribution EN

Thyristors have dominated this application for many decades. Nowadays thyristors as well as IGBTs are used in HVDC systems and FACTS to fulfill different needs.

Length 1:39


Storing solar energy at home

Storing solar energy at home

New technology from Infineon promotes the adoption of renewables by enabling solar energy to be stored efficiently

Length 8:05


Renewable energy from offshore wind farms

Renewable energy from offshore wind farms

Energy means life: It heats houses, powers cars and lights megacities. The global appetite for energy is voracious, while resources are dwindling. One third of the energy consumed worldwide is electricity and the trend is rising. The name of the key energy source of the future is energy efficiency. Optimal electricity use is achieved by harnessing smart semiconductor technology: Innovative chip solutions fine-tune cars, industrial plants, consumer and household electronics to use less energy.

Length 7:32



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