Infineon® HybridPACK™1 is a power module designed for Hybrid Electrical Vehicle (HEV) applications for a power range up to 30 kW. Designed for a junction operation temperature at 150°C, the module accommodates a Six-Pack configuration of 3rd generation Trench-Field-Stop IGBT and matching emitter controlled Diodes and is rated up to 400A/650V.
It is based on Infineon®’s leading IGBT Trench-Field-Stop Technology, which offers lowest conduction and switching losses.
Based on the long time experience in the development of IGBT power modules and intense research efforts of new material combinations and assembly technologies, as well as the usage of modern power semiconductor chips, Infineon has developed – dedicated for HEV – this HybridPACK™1 power module belonging to the HybridPACK™ family.
HybridPACK™1 is suitable for air or low temperature liquid cooled inverter systems. The flat copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides unparalleled thermal cycling and power cycling reliability for mild hybrid inverter applications. For a compact inverter design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.
HybridPACK™1 Pin-Fin package is a HybridPACK™1 with a Pin-Fin baseplate replacing the flat baseplate. This direct cooling concept increases the power density of the package significantly.