HybridPACK™ Modules
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With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed three new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications. Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
For evaluation purposes Infineon® is offering a complete Hybrid-Kit solution consisting of a HybridPACK™1 or HybridPACK™2 module, driver board, logic board and a special designed power capacitor from EPCOS®. The driver board, which is separately available as well, is based on a typical six channel IGBT driver circuit configuration realised using 6 x 1ED020I12-FA. It is mechanical and electrical optimised to be used together with the HybridPACK™1 module.
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Document Types
| Title | Date | Version | Size |
|---|---|---|---|
Product Brief
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| 10 Feb 2012 | english | 252 KB | |
| 16 Apr 2012 | english | 403 KB | |
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Application Notes
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Hybrid Kit for HybridPACK™2 (Infineon - AN2011-03 - Hybrid Kit for HybridPACK™2.pdf) |
25 Mar 2011 | english | 4.1 MB |
Hybrid Kit for HybridPACK™1 (Infineon - AppNote - Hybrid Kit for HybridPACK™1.pdf) |
05 Apr 2012 | english | 4.7 MB |
| 18 Nov 2010 | english | 1.8 MB | |
| 25 Aug 2010 | english | 895 KB | |
| 25 Aug 2010 | english | 796 KB | |
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Product Brochure
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Hybrid Electric & Electric Cars (Hybrid Electric and Electric Cars BR_2013_Web.pdf) |
12 Apr 2012 | 2010/2011 | 5.4 MB |