Hybrid Power Modules
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With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed three new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications. Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
For evaluation purpose Infineon® is offering a complete Hybrid-Kit solution consisting of a dedicated driver board, an adapter board, a HybridPACK™1 module and a separately to be ordered special designed power capacitor from EPCOS®. The driver board, which is separately available now, is based on a typical six channel IGBT driver circuit configuration realised using 6 x 1ED020I12-FA. It is mechanical and electrical optimised to be used together with the HybridPACK™1 module.
