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With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed three new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications. Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
For evaluation purposes Infineon® is offering a complete Hybrid-Kit solution consisting of a HybridPACK™1 or HybridPACK™2 module, driver board, logic board and a special designed power capacitor from EPCOS®. The driver board, which is separately available as well, is based on a typical six channel IGBT driver circuit configuration realised using 6 x 1ED020I12-FA. It is mechanical and electrical optimised to be used together with the HybridPACK™1 module.
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