DirectFET™

 
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DirectFET™

Leverage your performance

Header_DirectFET

 

DirectFET™ has a uniquely simple construction that provides breakthroughs in die free package resistance, parasitic package inductance and heat dissipation capabilities. Compared to standard discrete packages DirectFET™ metal "can" construction enables double-sided cooling to effectively increase the efficiency and curent carrying capability of the device in a given footprint. DirectFET™ is compatible with today's high volume manufacturing processes.

 

Together with the latest MOSFET silicon technology, DirectFET™ products are the right choice for a wide range of applications where thermal behavior, energy efficiency and power density are in focus. 


Power Management Selection Guide 2016


Product OPN Product Status Green Package Technology
Matching Results: 26                  
descending ascending       descending ascending descending ascending
IRF66SQ-25  

IRF66SQ-25

active

MicroStencil
Trench Mosfet
IRF66MN-25  

IRF66MN-25

active

MicroStencil
Trench Mosfet
IRF66S3C-25  

IRF66S3C-25

active

MicroStencil
Trench Mosfet
IRF66L4-25  

IRF66L4-25

active

MicroStencil
Trench Mosfet
IRF66MT-25  

IRF66MT-25

active

MicroStencil
Trench Mosfet
IRF66M4-25  

IRF66M4-25

active

MicroStencil
Trench Mosfet
IRF66SJ-25  

IRF66SJ-25

active

MicroStencil
Trench Mosfet
IRF66S2-25  

IRF66S2-25

active

MicroStencil
Trench Mosfet
IRF66MF-25  

IRF66MF-25

active

MicroStencil
Trench Mosfet
IRF66M2-25  

IRF66M2-25

active

MicroStencil
Trench Mosfet
IRF66MQ-25  

IRF66MQ-25

active

MicroStencil
Trench Mosfet
IRF66LT-25  

IRF66LT-25

active

MicroStencil
Trench Mosfet
IRF66SH-25  

IRF66SH-25

active

MicroStencil
Trench Mosfet
IRF66ME-25  

IRF66ME-25

active

MicroStencil
Trench Mosfet
IRF66S1-25  

IRF66S1-25

active

MicroStencil
Trench Mosfet
IRF66L8-25  

IRF66L8-25

active

MicroStencil
Trench Mosfet
IRF66MZ-25  

IRF66MZ-25

active

MicroStencil
Trench Mosfet
IRF67MA-25  

IRF67MA-25

active

MicroStencil
Trench Mosfet
IRF66MD-25  

IRF66MD-25

active

MicroStencil
Trench Mosfet
IRF66SB-25  

IRF66SB-25

active

MicroStencil
Trench Mosfet
IRF66SA-25  

IRF66SA-25

active

MicroStencil
Trench Mosfet
IRF66L6-25  

IRF66L6-25

active

MicroStencil
Trench Mosfet
IRF66MP-25  

IRF66MP-25

active

MicroStencil
Trench Mosfet
IRF66MA-25  

IRF66MA-25

active

MicroStencil
Trench Mosfet
IRF66MX-25  

IRF66MX-25

active

MicroStencil
Trench Mosfet
IRF66ST-25  

IRF66ST-25

active

MicroStencil
Trench Mosfet

DirectFET™


Applications Benefits  
  • Highest efficiency and power density
  • Less device paralleling
  • System cost improvement
  • Lowest board space consumption
  • No external snubber networks needed
  • Minimized EMI
  • Easy to design-in
  • Environmentally friendly

 

 


DirectFET™

Application Notes

Title Size Date Version
132 KB 09 Dec 2003
981 KB 07 Jan 2005
3.7 MB 29 Jun 2016 29_00
701 KB 30 Nov 2015 01_00

Product Selection Guide

Title Size Date Version
21 MB 22 Feb 2016 00_00

DirectFET™

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