Infineon Introduces SmartPIM and SmartPACK Power Modules; Use of Self-acting PressFIT Assembly

Neubiberg and Nuremberg, Germany – May 12, 2009 – At the PCIM 2009 Exhibition and Congress in Nuremberg, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced its new Smart family of IGBT (Insulated Gate Bipolar Transistor) modules. The housing design of the Smart modules allows deploying self-acting PressFIT technology to assemble a Smart module to the printed circuit board and to the heat sink in a single-step mounting process using one screw only. By offering a high-quality alternative of strong reliability to today’s solder connections, Infineon fulfils the needs of inverter designs in the range of up to 55 kW. Smart modules enable power converter system solutions optimized for various general-purpose and variable drives, Uninterruptible Power Supply (UPS), inductive heating and welding equipment, solar inverters and air conditioning systems.

Safe and Simple Self-acting PressFIT Assembly
The innovative combination of the renowned PressFIT technology with the self-acting assembly and mounting to the heat sink in one single step succeeds to simplify the manufacturing process and significantly reduces manufacturing time to a few seconds. By tightening the screw, the counter holder presses the PressFIT pins into the holes on the PCB. A cold-welded and reliable gas-tight connection is generated. The module is mechanically fixed to the heat sink and the PCB onto the module. Due to the innovative housing concept with an inner module core and an outer frame the sensitive components, such as IGBT chips, diodes and the ceramic, are secured during mounting and over lifetime, so DCB (Direct Copper Bonding) cracks are almost impossible.

The Smart family
The IGBT modules SmartPACK1 (six pack configuration) and SmartPIM1 (six pack configuration with input rectifier and brake chopper) are the first members of the Smart family of power modules covering an inverter power range from approximately 2.2 kW to 11 kW. With SmartPIM2, SmartPACK2, SmartPIM3 and SmartPACK3, which will follow later, the whole family will cover a current range of up to 200 A distributed over the different housing sizes. Therefore, SmartPIM and SmartPACK modules are available for inverters ranging up to 55 kW.

Availability
Samples of the Smart modules are available in Q3 2009 with start of production scheduled for Q4 2009.

Infineon at PCIM Europe 2009 Show
Infineon is demonstrating the latest Smart modules, MIPAQ™ modules, Silicon Carbide products and other innovations in its Booth #404, Hall 12 at the PCIM Europe 2009 Trade Show (Nuremberg, Germany, May 12-14). For an overview of Infineon’s conference presentations please see www.infineon.com/pcim2009 

Further information on Infineon’s new Smart module family of SmartPIM and SmartPACK modules is available at www.infineon.com/highpower. For Infineon’s product portfolio of power semiconductors and modules please go to www.infineon.com/power  

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Further information is available at www.infineon.com