At a glance

Take responisbitily for DB process sustaining and improvement

Quick info

Location Wuxi | 无锡
Entry level Professionals / experienced
Job ID 16463
Start Mar 31, 2017
Type Full time
Contract Permanent

Job description

In your new role you will:

  • Be responsible for yields, quality and cost sustainment and continuous improvement for Product Line.
  • Dispose day-to-day internal abnormal case, deal with MRB and customer issue (FAR).
  • Keep daily focus on line activities without any non-compliance and continuous improvement of line employees’ quality mindset .
  • Initiate and update die bonding specification, FMEA, Control Plan ,failure catalogue and etc.
  • Identify opportunity for improvement in current establish process.
  • Conduct review on training content to ensure most process changes are included and follow procedure.
  • Provide on-call services for shop floor critical application where necessary.
  • Profile

    You are best equipped for this task if you have:
    • Bachelor Degree in Mechanism/ Electrical and Electronics/Automation Engineering .
    • More than 5 years die bond experience in semiconductor backend field. 2 years' experience with die bonding machine or achievement in die bonding improvement project handling is a plus.
    • Be Familiar with eutectic bond or glue bond process.
    • Be familiar with most key die bond machine in the market, such as TOSOK(JCM) , ASM, ESEC.
    • Solid knowledge of DMAIC, MSA, DOE, 8D, FMEA, control plan etc.
    • Systematic logic thinking and problem solving skill.
    • Be good at time management.
    • Be able to work under pressure.
    • Good communication skill in both Chinese and English.

    About Us

    Part of your life. Part of tomorrow.

    We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world – we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.

    Backend

    The back-end segments Sensors, Chip Card and Chip Embedding allow the development of cross-collaborative innovations over the entire value chain from chip production to wafer testing, preassembly, package design and the development of new materials.

    What we offer you in Wuxi

    There are four different sites for Infineon in China: Shanghai, Wuxi, Beijing and Shenzhen.

    Find out more about our location Wuxi