Coil on Module (CoM) - the revolution for dual interface card production

Frost & Sullivan Best Practice Award

"Coil on Module" recognised with 2013 Global Frost & Sullivan "New Product Innovation Leadership Award"

Each year, Frost & Sullivan presents this award to the company that has developed an innovative element in a product by
leverage leading-edge technologies. The award recognises the value added features/benefits of the product and the increased
ROI it offers customers, which in turn increases customer acquisition and overall market penetration potential.

"Infineon is a leading manufacturer of semiconductor solutions, which has enabled it to gain deeper expertise in
manufacturing processes and subsequently, on ways to improve chips and packaging technologies,"
said Frost & Sullivan
Global Programme Director, Digital Identification, ICT, Jean-Noel Georges. "Leveraging this experience, the company has
developed a complete solution for Dual Interface cards that bridge the gap from today's contact-based applications to
tomorrow's contactless world."


"Frost & Sullivan Award Press Release"

CoM supports the payment market trend towards dual interface

The innovative "Coil on Module" package technology from Infineon uses a Radio frequency link rather than the common mechanical-electrical connection between the card antenna and the module. It improves the robustness of a Dual Interface (DIF) payment card and simplifies card design and manufacturing, making it more efficient and up to five times faster than with conventional technologies. 

Dual Interface cards, which are used for both contact-based and contactless applications, are a fast growing segment of the global payments industry.

The innovative "Coil on Module" package technology from Infineon underlines our technology leadership and is based on our extensive semiconductor and module expertise as well as profound understanding of card manufacturer´s systems and requirements.

Advantages of the innovative package technology

The CoM package is based on the flip chip technology proven by millions delivered contact-based (CB) modules and comprises an integrated antenna allowing the superior reliable inductive coupling.

Inductive coupling technology for DIF applications employs two antennas, one on the module and one on the antenna inlay in the card. These antennas connect to each other with electromagnetic waves similar to the air interface of contactless cards.

The biggest benefit for the card manufacturers is the elimination of the mechanical electrical connection between card antenna and module providing the following major benefits:

  • Higher yield at card production 
  • Improved long term reliability 
  • Simplified card manufacturing process and logistics
  • Immediate start of high speed volume production of dual interface cards as there is full compatibility to standard contact-based card production equipment
  • Reduction of total cost of ownership of dual interface cards without additional invest
  • 20% reduced module thickness enabling better back side visual appearance of card in area of module implanting
  • Improved corrosion resistance in comparison to state of the art products

Technical details

The system of a dual interface CoM card consists of the following major components:

  • Module with Antenna including the micro controller chip and the contact pads according to ISO 7816
  • Card antenna inlay with antenna coil specifically tuned to meet the CoM requirements according to ISO 14443 and EMVCo 2.0.1 or PayPass v1.1
  • Card body (typically PVC material) consisting of decorative layers and protection layers

The antenna on the module communicates via inductive coupling with the card antenna.

Infineon has developed a coil design guide that defines parameters for the optimized layout of the card antenna. Furthermore Infineon has evaluated and qualified different antenna technologies (e.g. AL etched, wired, etc...) so that customers can easily start by ordering antennas compatible with IFX CoM.

A major advantage of the Infineon CoM design is the independence of Chip / Module combination and card antenna. The target is that customers can use different Chip / Module combinations form Infineon with one card antenna layout resulting in reduced inventory, reduced complexity of inventory, faster development cycles and faster time to market.


Application brochure

Product brief