Infineon Ramps Production of Chipsets for Millimeter Wave Backhaul; Several Gigabit Data Transfer Rate Covers Worldwide Operator Requirements

Oct 1, 2013 | Technology Media

Neubiberg, Germany – October 1, 2013 – Infineon Technologies has started the production of its BGTx0 chipsets for wireless backhaul communication systems. The transceiver family provides a complete radio frequency (RF) front-end for wireless communication in 57-64 GHz, 71-76 GHz, or 81-86 GHz millimeter wave bands. Paired with a baseband/modem, the system solution requires less space, offers improved reliability and lower cost for the critical wireless backhaul links needed in mobile base stations that support LTE/4G networks.

The lead customer Sub10 Systems is currently qualifying BGT70 and BGT80 E-band transceivers for an FDD (Frequency Division Duplex) system. Mark Stevens, Chief Technology Officer at Sub10 Systems, said: “We are delighted to be collaborating with Infineon on integration of the BGT70 and BGT80 chipset into our newly developed E-band transceiver. We expect high performance and high reliability at the same time, therefore we have chosen the best solution in the market.” The targeted system supports a data rate of more than 1 Gbit/s with link distances of about 2.5 kilometers.

Infineon’s BGTx0 family simplifies system design and production logistics by replacing more than 10 discrete devices by a single device. Due to their low power consumption the single-chip high-integration transceivers also help to reduce operating expenses in high data rate millimeter wave infrastructures

“The wide bandwidth available in V- and E-band millimeter-wave frequencies supports the exploding usage of mobile data with great growth opportunities for Infineon. With our process technology and RF design leadership we offer exactly what the emerging small cell infrastructure requires: highly reliable and easy to use packaged millimeter-wave transceivers,” said Philipp von Schierstaedt, Vice President and General Manager of the Business Unit RF & Protection Devices at Infineon Technologies. “The great interest of customers shows that our BGTx0 family perfectly meets their requirements.”

Each mobile communication standard uses specific frequency bands to transport data. Current standards operate below 43 GHz, known as microwaves. As future standards – like latest LTE/4G – will require more capacity and higher data rates, public authorities have released V- and E-band using millimeter waves. Network operators are expected to invest heavily in small cell infrastructures in the years ahead in order to provide mobile phone users with high speed internet and full network coverage.


Engineering samples of BGTx0 transceivers are already available. Volume production is planned for spring 2014.

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About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2012 fiscal year (ending September 30), the Company reported sales of Euro 3.9 billion with close to 26,700 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

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Press Photos

  • Devices in the Infineon BGTx0 product family come in a standard plastic package and replace more than 10 discrete devices used in current system designs with one single chip.
    Devices in the Infineon BGTx0 product family come in a standard plastic package and replace more than 10 discrete devices used in current system designs with one single chip.

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