Infineon Introduces World’s Highest Integrated VoIP Solution for Next Generation Access Applications
Las Vegas, USA and Neubiberg, Germany – June 16, 2008 – Today at the NXTcomm 2008 Show, Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, introduced the VINETIC™-SVIP, a new family of devices developed for next-generation VoIP access applications. By enhancing the mature and field-proven technology currently offered in Infineon's low power, high-performance VINETIC and SLIC products, the VINETIC-SVIP family of System-on-Chip (SoC) solutions provide unsurpassed density and scalability.
The Infineon VINETIC-SVIP includes 16 voice Codecs, 32 VoIP coder channels, a line card controller and a Gigabit Ethernet-Switch (GigE Switch) to offer the highest level of integration on the market today. This architecture allows products based on the VINETIC-SVIP to be seamlessly scalable and upgradable at minimal cost.
When combined with Infineon's new two-channel Smart SLIC-R, the VINETIC-SVIP can reduce the overall bill of material for VoIP systems by up to 40 percent and can shrink the line interface unit footprint by up to 30 percent compared to current solutions in the market. Used in conjunction with Infineon's leading xDSL and ISDN chip sets, the VINETIC-SVIP provides a best-in-class VoIP solution for multiple access network applications.
“As VoIP gains mass market acceptance and the transition from the traditional TDM voice network architecture to the converged data and VoIP Next Generation Network gains momentum, system developers are looking for more flexible, scalable, low-cost VoIP solutions,” said Christian Wolff, Senior Vice President of the Communication Solutions business group and General Manager of the Wireline Access business unit at Infineon. “The VINETIC-SVIP includes a unique architecture that ensures a faster time-to-market for our customers by minimizing the development time and offering a low-cost bill-of-material.”
The Infineon VINETIC-SVIP family is based on the 16-channel CODEC/SLIC architecture with slim digital interfaces which simplify circuit board layout while optimizing component density. An on-chip DSP offers sufficient processing power to support additional features beyond current requirements. Future upgrades can be achieved without hardware changes.
The VINETIC-SVIP family of products include an integrated line card controller and is the first line card CODEC/SLIC solution that fully supports wideband voice (16 kHz sampling and wideband analog filters). It is fully compatible with legacy POTS equipment and services, and offers advanced integrated line testing with test head (MLT) accuracy. These advanced integrated test and diagnostic functions offer additional sophisticated service qualification and loop monitoring features that allow real-time monitoring of voice quality and network stability.
Engineering samples of the VINETIC-SVIP and Smart SLIC-R parts and complete design-in and system package (including evaluation board, hardware design guide, schematics, firmware, high level API software) are available now.
For more information please check the Infineon web site at: www.infineon.com/VINETIC-SVIP
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the com-pany reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidi-aries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).
Further information is available at www.infineon.com.
The VINETIC(tm)-SVIP offers the highest level of integration on the market today. It can reduce the overall bill of material for VoIP systems by up to 40 percent and can shrink the footprint by up to 30 percent compared to current solutions.5749-PEF_33616E_300dpi_final
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