Single chip CAT-iq™ wireless engine for VoIP basestations from Infineon® lowers bill of material for cordless VoIP designs by 40 per cent

Jan 29, 2008 | Technology Media

Amsterdam, Netherlands and Neubiberg, Germany – January, 29 2008 – At the DECT08 conference today in Amsterdam, Infineon Technologies (FSE/NYSE: IFX) announced the world's first single chip CAT-iq™/DECT wireless engine for basestations, dubbed COSIC™ (Cordless Single Chip)-Modem. The COSIC-Modem integrates the baseband processor, transceiver and power amplifier in a monolithic CMOS single chip for high quality cordless IP telephony. In combination with Infineons broadband CPE (customer premises equipment) SoCs (System on Chips) Danube for ADSL2/ 2+, Twinpass for Ethernet and VINAX™-VE for VDSL2, the COSIC-Modem handles up to six handsets in HD (high definition) sound quality at the same time and offers access to data applications as described in the CAT-iq™ roadmap.

With backward compatibility to DECT/DECT 6.0, the COSIC-Modem enables an optimized system design for CAT-iq™ cordless basestations by delegating the performing of the DECT software stack to the CPE SoC and focuses on the basic wireless communication tasks itself. This task partitioning eliminates the external memory required for the CAT-iq™ part in a base station and reduces at least 40% of the CAT-iq™ subsystem BOM (Bill of Material). Furthermore, as all applications are directly implemented on the memory of CPE SoCs', flexible resource management and remote feature update are achieved by this architecture for CPE vendors and service providers of both voice and data applications. COSIC-Modem especially supports adjustable radio levels for emission control.

The CAT-iq™ standard was launched worldwide at the ITU Telecom World 2006, as successor to the popular DECT standard. The current CAT-iq™ profile targets cordless HD sound applications based on G.722 wideband codec and will be expanded to low bit-rate data applications like music streaming, information display service, instant messaging, and advanced home control in the second half of 2008. As the main inventor of CAT-iq™, Infineon Technologies is heading these activities in the DECT-Forum.

“Among cordless technologies CAT-iq™/DECT offers significant advantages in reach, coverage, power consumption and worldwide acceptance, thus it gets more important in broadband home networks,” said Christian Wolff, Senior Vice President of the Communication Solutions business group and General Manager of the Wireline Access business unit at Infineon. “As the world's only vendor developing both digital cordless and broadband CPE solutions, Infineon keeps leading the market and supplying optimized solutions to our customers.”

Infineon ships the COSIC-Modem with its broadband CPE SoCs oriented CAT-iq™/DECT stack software featuring high level management API. COSIC-Modem is also available in a complete reference IAD design based on the Infineon SPINACER Linux software suite. With the world's smallest footprint of 7x7 mm² dimension, the silicon for volume production is shipped in a RoHs compliant VQFN package for easy integration and manufacturing.

Engineering samples of the COSIC-Modem are available. The production ramp-up is planned for the second quarter of the calendar year 2008. Additional information about the COSIC-Modem can be found on: www.infineon.com/DECT

CAT-iq™ is the registered trademark of the DECT Forum. CAT-iq™ is the new global technology for broadband home connectivity.

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).

Information Number

INFCOM200801.035