Infineon Promotes Broadband Penetration in Emerging Markets with New Highly Integrated ADSL2+ System-on-a-Chip

Mar 20, 2007 | Technology Media

Munich, Germany – March 20, 2007 – Infineon Technologies (FSE/NYSE: IFX) today announced a new ADSL2+ system-on-a-chip (SoC) for customer premise equipment (CPE) that will help drive broadband penetration in emerging markets.  Amazon-SE, the third generation of the field-proven Infineon ADSL/2/2+ CPE chip solutions, targets bridge-modem and USB (Universal Serial Bus) modem applications.  The chip’s highly integrated design helps to cut the external components count of an ADSL2+ modem by as much as ten percent compared with existing solutions, setting industry benchmarks for low BOM (bill-of-materials) costs and reduced system complexity.  
 
Offered in a PG-LQFP-144 (144-pin plastic green low profile quad flat package) package, the Amazon-SE allows for a two-layer PCB (printed circuit board) design, compared with the four layers required by existing solutions.  In USB modem applications, the Amazon-SE achieves further optimizations by eliminating the need for an external power supply and removing the Flash memory component altogether, because the modem is powered and booted from the user’s PC.
 
Amazon-SE features integrated SD/MMC (Secure Digital/MultiMedia Card) and SPI (Serial Peripheral Interface) interfaces, as well as programmable Packet Processor Engine (PPE) to also enable the design of WiFi ADSL2+ gateways with boosted routing performance allowing system integrators to offer an even broader range of ADSL2+ solutions based on a single hardware / software architecture.   
 
According to research firm iSuppli, shipments of ADSL modems and ADSL/WLAN gateways to Asia, China and Latin America will exceed 41 million units by 2008, compared with 28.5 million units shipped in 2006.
 
Infineon offers complete hardware/software system reference designs for ADSL2+ bridge-modem and router applications, thereby significantly reducing the development time and effort for system manufacturers.  
 
Fully supporting all ADSL2+ standards including ITU-T G.992.1/3/5 (ADSL/2/2+) annexes A, B, I, J, M, and L, ITU-T G.992.2 (G.lite) annex A and ANSI T1.413 Issue 2, Amazon –SE provides line-rate throughput up to 30 Mbit/s (downstream) for all packet sizes in Bridge-modem applications.
 
“With the Amazon-SE, Infineon provides its customers with an optimized solution to successfully address the high growth emerging broadband markets,” said Christian Wolff, Senior Vice President of the Communication Solutions business group and General Manager of the Wireline Access business unit at Infineon.  “The Amazon-SE is the newest member of our extensive CPE products family that enables system providers to serve multiple applications and markets using the same hardware / software platform”.
 
Availability
 
Engineering samples of the Amazon-SE are currently available, with production ramp-up planned for Q2 2007.  Additional information about the Amazon-SE can be found on: www.infineon.com/amazon.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions addressing three central challenges to modern society including energy efficiency, connectivity and security.  In fiscal year 2006 (ending September), the company achieved sales of Euro 7.9 billion (including Qimonda sales of Euro 3.8 billion) with approximately 42,000 employees worldwide (including approximately 12,000 Qimonda employees).  With a global presence, Infineon operates through its subsidiaries in the US from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo.  Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.

Information Number

INFCOM200703.047