InterDigital and Infineon Expand Cooperative Agreement to Include HSDPA Technology Development

Jan 19, 2006 | Technology Media

Joint News Release by Infineon and InterDigital

Munich, Germany and King of Prussia, PA, USA, January 19, 2006. InterDigital Communications Corporation (Nasdaq: IDCC) and Infineon Technologies (NYSE: IFX) today announced the expansion of their long standing cooperative development and marketing agreement to include the joint development of HSDPA (High Speed Downlink Packet Access) 3G protocol stack software technology for Infineon’s 3G platform.  HSDPA is a packet-based data service for 3G mobile networks supporting peak data transmission rates of 14 Mbps. 
Since March 2001, InterDigital and Infineon have been developing and commercializing 3G technologies and products in a strategic relationship. Under the expanded agreement, InterDigital and Infineon will continue to jointly develop and upgrade the 3G protocol stack incorporating UMTS Release 5 and HSDPA. InterDigital will be compensated for associated non-recurring engineering services.
“Infineon believes that by partnering with InterDigital in our 3G protocol stack development, we can more quickly bring a mature 3GPP Release 5 product to our customers, with committed HSDPA deliveries this quarter. We therefore are pleased to have expanded our joint 3G development with InterDigital to include HSDPA”, said Thomas Lindner, senior director for marketing at Infineon’s Mobile Software Business Unit.
“Infineon is the second customer for the HSDPA solution from InterDigital, further validating our strength as an effective technology partner and leading provider of HSDPA technology”, said Mark Lemmo, Senior Business Development and Product Management Officer.
InterDigital and Infineon also amended the royalty structure established in the original 2001 cooperative agreement. The new royalty rate structure extends the term and amends the per-unit royalty rates to be paid to InterDigital for the sale of Infineon’s ASICs containing jointly-developed software.
About InterDigital

InterDigital Communications Corporation designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G and 802 products worldwide. Additionally, the company offers baseband product solutions and protocol software for 3G multimode terminals and converged devices. InterDigital’s differentiated technology and product solutions deliver time-to-market, performance and cost benefits. For more information, please visit InterDigital’s web site: InterDigital is a registered trademark of InterDigital.

Media Contact at InterDigital:
Jack Indekeu
Investor Contact:
Janet Point
Tel: +1 (610) 878-7800

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2005 (ending September), the company achieved sales of Euro 6.76 billion with about 36,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at

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