Infineon Leads Industry to Next Generation Server Memory Modules: Reports Standard Server Platforms Boot-Up Using New Fully-Buffered DIMMs

Mar 1, 2005 | Technology Media

Munich, Germany and San Francisco, USA – March 1, 2005 – Infineon Technologies AG (FSE/NYSE: IFX) today announced at the Intel Developer Forum in San Francisco (March 1-3, 2005) that samples of its Fully-Buffered DIMMs (FB-DIMM) are successfully booting standard server systems of major OEMs. The milestone demonstrations on server platforms running a next generation Intel server chipset place Infineon at the development forefront for the next generation of memory subsystems.

FB-DIMMs, which are expected to begin replacing Registered DIMMs in high-end sytems starting 2006, are JEDEC-standardized modules designed for high-density and high-speed operation. The FB-DIMM architecture is based on a new memory interconnect technology standard for high-end memory connections. An on-module Advanced Memory Buffer (AMB) chip speeds memory performance and allows higher memory capacity on each module, and so lays the groundwork for future generation high performance modules based on DDR2 and DDR3 DRAM.

“Infineon is committed to meeting the requirements of customers developing the next generation of high-performance servers and workstations,” said Michael Buckermann, Head of the Computing Unit of Infineon’s Memory Product group. “With success in initial tests on platforms from several of our customers, we are now gathering key performance data and performing system level tests needed to pass the additional milestones leading to deployment of FB-DIMM on systems by the end of this year.”

The combination of high memory density and the on-module AMB chip leads to significant heat generation in the FB-DIMM. To manage the thermal load, the JEDEC standards organization defined a heat sink as part of the module. Infineon has developed a single-piece heat sink with tighter mechanical dimensions than the JEDEC specification. Infineon will supply customer sample FB-DIMMs using its own heat sink design, which the company’s tests indicate achieves superior thermal control.

The FB-DIMMs used in Infineon’s current demonstration systems are DDR2 based 512MB and 1GB modules with 533Mb/s or 667Mb/s speed grade. Infineon expects to release qualification samples of the modules to its customers by mid-2005, with initial customer shipments later this year.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2004 (ending September), the company achieved sales of Euro 7.19 billion with about 35,600 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at

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