Infineon Introduces Planar Solution for 2 Gbyte DDR2 Modules

Apr 15, 2004 | Technology Media

Munich, Germany – April 15, 2004 – Infineon Technologies AG (FSE/NYSE: IFX) today announced that it has shipped first samples of its 2 Gigabyte (GB) DDR2 Planar Registered Dual Inline Memory Modules (DIMMs). The modules use single-die 512 Megabit (Mbit) DDR2 memory chips in very compact Fine-Pitch Ball Grid Array (FBGA) packages and are based on a planar design. Currently available modules with densities greater than 1 GB use stacked-die. Infineon’s new planar solution for 2 GB modules is based on mature single-die components. System manufacturers will benefit from considerably flatter modules which with a thickness of 4.1 mm fulfil the requirements for DDR2 server applications and depending on the respective system configuration result in up to 10 percent reduced heat generation.

The 2 GB DDR2 Planar Registered DIMM, which is expected to become the preferred density of high-end server suppliers, targets high-performance data processing and storage applications in the server and storage infrastructure market. According to market research firm iSuppli the demand for mid-end and high-end servers units will increase from around 800,000 units in 2003 to approx. 1 million units in 2006 with an average growth rate of 9 percent per year.

“The successful deployment of single-die components in a planar high-density memory module solution once again underlines Infineon’s technology leadership and sets new standards for next generation memory,” said Dr. Carsten Gatzke, Senior Director Commodity DRAM Marketing at Infineon Technologies. “This innovative technology reduces complexity in component design, increases flexibility in product allocation and allows Infineon to efficiently respond to changing customer requirements in one of our focus markets - servers, workstations and storage systems.”

This new 2 GB Registered DIMM uses 36 single-die 512 Mbit DDR2 components in JEDEC (Joint Electronic Device Engineering Council) compliant 60-ball FBGA packages which operate at speeds of 400 Mbit/s and 533 Mbit/s.

With the introduction of the 2 GB DDR2 Planar Registered DIMM, Infineon optimizes its DDR2 standard portfolio of registered modules with memory densities of 256 MB, 512 MB, 1 GB, 2 GB and 4 GB. Each DIMM except the 4 GB module is based on a planar design.

Price and Availability

Samples of the 2 GB DDR2 Planar Registered DIMM are available in an organization of 256 Mbit x 72 (2 Rank x4), for speeds of PC2-3200 and PC2-4300 at unit prices from US-Dollar 700,- to 910,-. Volume production is planned to start in the second half of calendar year 2004.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2003 (ending September), the company achieved sales of Euro 6.15 billion with about 32,300 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.

Information Number

INFMP200404.056

Press Photos

  • Infineon's new planar solution for 2 GB DDR2 modules is based on mature single-die components. System manufacturers will benefit from considerably flatter modules which with a thickness of 4.1 mm fulfil the requirements for DDR2 server applications and depending on the respective system configuration result in up to 10 percent reduced heat generation.
    Infineon's new planar solution for 2 GB DDR2 modules is based on mature single-die components. System manufacturers will benefit from considerably flatter modules which with a thickness of 4.1 mm fulfil the requirements for DDR2 server applications and depending on the respective system configuration result in up to 10 percent reduced heat generation.
    Planar solution for 2 GB DDR2 modules

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    Planar solution for 2 GB DDR2 modules

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