Infineon Enhances Multi-Standard ADSL & POTS Platform For Next Generation Packet-Voice and Data Networks
Supercomm, Atlanta, GA June 2, 2003 Infineon Technologies (FSE/NYSE: IFX) today announced the IPVD (Integrated Packet Voice and Data) platform, an enhancement to its field-proven solution for IVD (Integrated Voice and Data) line cards. The IPVD platform combines Infineons new high-integration GEMINAX MAX ADSL chipset with the VINETIC family of integrated voice processors. It provides manufacturers of access systems with a flexible, upgradeable and cost-effective solution for integrated ADSL and voice line cards that are compliant with all current standards and ready to support the transition to packet-voice telephony and higher data rate applications, including video delivery.
Infineon pioneered IVD technology several years ago, and is the only semiconductor manufacturer that offers a one-stop-shop for analog voice, ISDN and xDSL solutions, eliminating many of the problems encountered during the integration of multi-vendor chipsets.
Infineon will demonstrate triple-play voice, video and data using the IPVD platform in its booth (#22637/22737) at Supercomm 2003, June 3 5 in Atlanta.
The IPVD platform offers a single chipset solution for existing as well as upcoming standards. For data it supports ADSL, ADSL2 and ADSL2+, and for voice it supports TDM and Packet-Voice, as well as ISDN. The modular nature of the platform allows system vendors to design ADSL, POTS, ISDN, ADSL-over-POTS, and ADSL-over-ISDN line cards based on a single chipset. Thus, manufacturers can shorten time to market and leverage development investment across all end applications, including Central Office (CO), Digital Subscriber Line Access Multiplexer (DSLAM), Digital Loop Carrier (DLC) and Multi Service Access Platform (MSAP).
Service providers are demanding converged services in their networks, and therefore communication system providers are transitioning from traditional DSLAMs and DLCs to the next generation of MSAPs, said Christian Wolff, Vice President of Infineons Wireline Communications Business Group and General Manager of Access Products. As telcos and ISPs move to adopt business models that combine packet voice with increasingly high speed DSL services, our customers can expedite designs and shorten time to market by using this single, market-proven platform.
Integrated Voice-Data systems are a growing market, as carriers look to build cost-optimized ADSL over POTS solutions at the CO, said Ken Furer, research analyst at International Data Corp. Products like the Infineon IPVD platform anticipate the next step in integration and provide a natural transition for enhancing networks at the Loop Carrier level, where size and power join system cost issues as critical elements in system design.
Infineons IPVD supports traditional TDM as well as Packet-Voice in both Voice over Internet Protocol (VoIP) and Voice over ATM (VoATM) modes, without any hardware changes. It supports fully integrated voice compression codecs (G.72x) and both near-end and far-end line echo cancellation according to G.168. Standard TDM voice requirements such as DTMF detection and Caller-ID generation are also integrated. Full software programmability of telephony parameters enables a single hardware design to be adapted to all worldwide requirements.
Where required, the platform can provide extensive narrowband and broadband line testing features, enabling remote network supervision and control, and thereby offering further system cost reduction.
By integrating both the POTS splitter and the voice processing DSP, the Infineon IPVD platform offers industry-leading density of approximately one square inch of board space per channel.
An IPVD development kit is available to qualified customers at a price of $4500. The kit includes an IPVD evaluation board, development software tools and Application
Programming Interfaces (APIs). The documentation includes reference design schematics, layout recommendations and BOM.
Infineon pioneered IVD technology several years ago, and is the only semiconductor manufacturer that offers a one-stop-shop for analog voice, ISDN and xDSL solutions, eliminating many of the problems encountered during the integration of multi-vendor chipsets.
Infineon will demonstrate triple-play voice, video and data using the IPVD platform in its booth (#22637/22737) at Supercomm 2003, June 3 5 in Atlanta.
The IPVD platform offers a single chipset solution for existing as well as upcoming standards. For data it supports ADSL, ADSL2 and ADSL2+, and for voice it supports TDM and Packet-Voice, as well as ISDN. The modular nature of the platform allows system vendors to design ADSL, POTS, ISDN, ADSL-over-POTS, and ADSL-over-ISDN line cards based on a single chipset. Thus, manufacturers can shorten time to market and leverage development investment across all end applications, including Central Office (CO), Digital Subscriber Line Access Multiplexer (DSLAM), Digital Loop Carrier (DLC) and Multi Service Access Platform (MSAP).
Service providers are demanding converged services in their networks, and therefore communication system providers are transitioning from traditional DSLAMs and DLCs to the next generation of MSAPs, said Christian Wolff, Vice President of Infineons Wireline Communications Business Group and General Manager of Access Products. As telcos and ISPs move to adopt business models that combine packet voice with increasingly high speed DSL services, our customers can expedite designs and shorten time to market by using this single, market-proven platform.
Integrated Voice-Data systems are a growing market, as carriers look to build cost-optimized ADSL over POTS solutions at the CO, said Ken Furer, research analyst at International Data Corp. Products like the Infineon IPVD platform anticipate the next step in integration and provide a natural transition for enhancing networks at the Loop Carrier level, where size and power join system cost issues as critical elements in system design.
Infineons IPVD supports traditional TDM as well as Packet-Voice in both Voice over Internet Protocol (VoIP) and Voice over ATM (VoATM) modes, without any hardware changes. It supports fully integrated voice compression codecs (G.72x) and both near-end and far-end line echo cancellation according to G.168. Standard TDM voice requirements such as DTMF detection and Caller-ID generation are also integrated. Full software programmability of telephony parameters enables a single hardware design to be adapted to all worldwide requirements.
Where required, the platform can provide extensive narrowband and broadband line testing features, enabling remote network supervision and control, and thereby offering further system cost reduction.
By integrating both the POTS splitter and the voice processing DSP, the Infineon IPVD platform offers industry-leading density of approximately one square inch of board space per channel.
Development Kit and Pricing
An IPVD development kit is available to qualified customers at a price of $4500. The kit includes an IPVD evaluation board, development software tools and Application
Programming Interfaces (APIs). The documentation includes reference design schematics, layout recommendations and BOM.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2002 (ending September 2002), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
Infineon, Infineon Technologies, and the stylized Infineon Technologies design are registered trademarks and service marks and IPVD, GEMINAX and VINETIC are trademarks of Infineon Technologies AG in the United States and/or other countries. Other company, product and service names may be trademarks or service marks of others.
Information Number
INFCOM200306.080