Infineon Announces Engineering Sample Release of One Gigabyte and Demonstration of Two Gigabyte DDR SDRAM Modules; First High-Density DIMMs Built With Single-Chip 512Mb Memory Components

Mar 25, 2002 | Technology Media

Munich, Germany – March 25, 2002 – Infineon Technologies (FSE/NYSE: IFX) today announced the release of engineering samples of 1 Gigabyte (GB) unbuffered DDR SDRAM Dual Inline Memory Modules (DIMMs) and the demonstration of fully functional 2 Gigabyte (GB) registered DDR SDRAM DIMMs. The 1GB DIMMs are for high-end PC’s and workstations, the 2GB DIMMs are for main memory applications in the workstation and server market. The new modules are the industry’s first commercial high-density modules based on monolithic (single-chip) 512Mb memory components, providing system OEMs with performance advantages in signal loading, speed, quality and reliability.

The 2GB registered modules, which were publicly demonstrated on the ServerWorks GC-LE/Prestonia during the Intel Developer Forum last month, are being demonstrated this week at the JEDEX Conference in Santa Clara. The latest demonstrations, March 25 – 26, are running on Intel’s Plumas/Prestonia platform.

Because the 512Mb components used in the new modules use only one silicon chip in a TSOP II package, the Infineon DIMMs achieve superior signal integrity, lower power consumption and higher reliability ratings compared to currently available modules, which use two silicon die in a package. The 1GB unbuffered DIMM uses 18 pieces of 512Mb components configured as 64M x 8. The 2GB registered DIMM uses 36 pieces of stacked 512Mb components organized 256M x4 which means it can support chip-kill, a feature now found on advanced memory controller systems. Both of the new DIMMs are 184 pin, 2.5V devices, available in speed grades for PC1600 and PC2100.

Currently the highest density modules available in an industry-standard DIMMs, the Infineon modules leverage the memory handling capability of advanced workstation and server chipsets, enabling system suppliers to double on-board memory compared to systems integrating modules based on 256Mb components.

Price and Availability


Sample quantities of 1GB currently available priced at US $1,900. Samples of the 2GB registered DIMMs will be available to qualified customers during the April time frame at a price of US$ 3,900. Volume pricing is available on request.

About Infineon


Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2001 (ending September), the company achieved sales of Euro 5.67 billion with about 33,800 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.


© Copyright 2002 Infineon Technologies AG. All rights reserved. Infineon and the stylized Infineon Technologies design are registered trademarks and service marks of Infineon Technologies AG. Other trademarks may be the property of their respective owners.

Any statements in this document that are not historical facts are forward-looking statements that involve risks and uncertainties; actual results may differ from the forward-looking statements. Infineon Technologies undertakes no obligation to publicly release the results of any revisions to these forward-looking statements that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.

Information Number

INFMP200203.064e

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  • Infineon Announces Engineering Sample Release of One Gigabyte and Demonstration of Two Gigabyte DDR SDRAM Modules; First High-Density DIMMs Built With Single-Chip 512Mb Memory Components
    Infineon Announces Engineering Sample Release of One Gigabyte and Demonstration of Two Gigabyte DDR SDRAM Modules; First High-Density DIMMs Built With Single-Chip 512Mb Memory Components
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