Infineon Announces the Shipment of 7 Million Bluetooth ICs and Unveils the New Bluetooth Chip - BlueMoon Universal in 0.13 Micron CMOS-Technology
Amsterdam, Netherlands June 13, 2002 Infineon Technologies AG (FSE/NYSE: IFX), a leading IC vendor in Local Area Wireless, today announced that it has shipped over seven million Bluetooth units as of June 2002. In addition to that, Infineon unveiled its new and powerful Bluetooth Single-Chip, the BlueMoon Universal, a single chip solution, manufactured in a 0.13 micron CMOS-Technology. Due to the minimized die size, both power consumption and the total size of a module are significantly reduced. Infineon is demonstrating the BlueMoon Universal in a standard leadless package smaller than 36mm² at the Bluetooth Congress in Amsterdam 2002, June 12 - 14.
BlueMoon Universal will have integrated USB, PCM (SSI), UART, CODEC interfaces as well as an ARM7 processor for Linkmanager and upper layer stacks. An API (application programmable interface) will ensure the possibility to generate embedded hostless solutions. The new chip will be available in two different memory variants, with ROM or embedded Flash. This IC solution is a highlight of the BlueMoon product family, offering access to the latest technology innovations, such as 0.13 µm CMOS RF and Flash providing small and low cost solutions for Bluetooth applications.
With shipments of over seven million Bluetooth ICs, we extend our market share in this strongly increasing market, said Hubert Christl, Vice President and General Manager Local Area Wireless at Infineon Technologies. Furthermore, Infineon strongly commits to its innovative Bluetooth roadmap in terms of feature enhancement and integration by presenting the new BlueMoon Universal.
BlueMoon Universal is offered at a price below 3.75 US$ in high volume quantities. First development kits will be available late 2002 with volume production starting in 2003.
BlueMoon Universal will have integrated USB, PCM (SSI), UART, CODEC interfaces as well as an ARM7 processor for Linkmanager and upper layer stacks. An API (application programmable interface) will ensure the possibility to generate embedded hostless solutions. The new chip will be available in two different memory variants, with ROM or embedded Flash. This IC solution is a highlight of the BlueMoon product family, offering access to the latest technology innovations, such as 0.13 µm CMOS RF and Flash providing small and low cost solutions for Bluetooth applications.
With shipments of over seven million Bluetooth ICs, we extend our market share in this strongly increasing market, said Hubert Christl, Vice President and General Manager Local Area Wireless at Infineon Technologies. Furthermore, Infineon strongly commits to its innovative Bluetooth roadmap in terms of feature enhancement and integration by presenting the new BlueMoon Universal.
Availability and Pricing of BlueMoon Universal
BlueMoon Universal is offered at a price below 3.75 US$ in high volume quantities. First development kits will be available late 2002 with volume production starting in 2003.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2001 (ending September), the company achieved sales of Euro 5.67 billion with about 33,800 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
Information Number
INFWS200206.102 e