Infineon Announces Industry's Smallest, Full-Featured Dual Channel Codec/SLIC Chipset Ideal for VoIP Applications

Aug 28, 2001 | Technology Media

San Jose/Munich, Germany, August 28, 2001 – Infineon Technologies (FSE/NYSE: IFX), a leading provider of communications integrated circuits, announced today the availability of its reduced-size dual-channel codec/SLIC chipset DuSLIC. Offering the richest feature set available on the market today, this highly integrated chipset requires only 32 percent of the board space consumed by comparable chipsets. The highly integrated devices that make up the chipset benefit system providers by reducing PCB size and cost, and are ideal for high-density network access platforms and customer premises equipment in VoIP and VoDSL applications.

“Our new chipset allows customers to enhance the competitive edge of their analog POTS solutions by giving them the flexibility to design cost-effective high-density line cards and compact IADs without having to compromise on performance,“ said Christian Wolff, vice president of Infineon‘s Communications group and general manager of its carrier access business unit.

The reduced-size dual-channel codec/SLIC chipset consists of new SLIC and codec devices. The new SLIC devices are in a 7 by 7 millimeter, 48-pin package with a copper lead frame that provides excellent electrical and thermal performance, and include devices designed for 3.3V operation in low-power applications. The new codec device is set in 12 by 12 millimeter TQFP packages, operating from only 3.3V supplies, offering extreme low power operation.

The DuSLIC Product Family

The DuSLIC product family provides a dual-channel analog telephone termination, optimized for access network and customer premises applications. The software programmable DuSLIC provides a comprehensive set of new system features, optimum voice and modem transmission performance (i.e. LSSGR TR57, ITUQ.552, and G.712) together with extreme low power consumption. An advanced feature set which includes Line Echo Cancellation, Tone Detection, DTMF recognition or Caller ID qualify it as an ideal solution for Voice over Packet applications. The comprehensive integrated test and diagnostic functions enable the service provider to perform remote circuit and line testing, without the need for test relays or costly test units. A single hardware design can be adapted through simple firmware download to all worldwide applications and country specific requirements. All analog line card functions like ringing, metering (teletax), DC feeding, impedance matching, hybrid balancing, frequency response, gain and µ/A law compression can be controlled and optimized via software. The interconnections between the fully programmable dual channel Slicofi-2 CODEC and the two single channel SLIC chips are seamless, guaranteeing maximum transmission performance with a minimal number of external components.

Pricing and Availability

The new DuSLIC devices announced today are now available in sample and production quantities. The chipset will be priced under US$9 per port in 1k quantities. Please contact your local sales office for high-volume pricing. Further information including datasheets, application notes, development tools and white papers on the DuSLIC chipset are also available at

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2000 (ending September), the company achieved sales of Euro 7.28 billion with about 29,000 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at

Infineon and the stylized Infineon Technologies design are trademarks and servicemarks of Infineon Technologies AG. All other trademarks are the property of their respective owners.

Any statements in this document that are not statements of historical fact are "forward-looking" and therefore involve risks and uncertainties; actual results may differ from such forward-looking statements. Important factors that could cause actual results to differ from those indicated by such forward-looking statements include uncertainties relating to the acceptance of our communications IC solutions, including our xDSL technology offerings, and other business factors and uncertainties that are discussed in our filings with the U.S. Securities and Exchange Commission, including in the "Risk Factors" section of our Annual Report on Form 20-F for the year ended September 30, 2000. Infineon Technologies undertakes no obligation to publicly release the results of any revisions to these forward-looking statements that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.

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