Infineon to Describe Chip Innovations, Present View of Mobile Multimedia Development at Leading International Technical Conference

San Francisco, Calif.– February 6, 2006 – Infineon Technologies (FSE/NYSE: IFX), a leading supplier of advanced semiconductor products across a wide technology spectrum, today announced that it is presenting 13 technical papers and is participating in several panels and tutorial sessions at the ISSCC 2006 (IEEE International Solid-State Circuits Conference), taking place this week in San Francisco.  Additionally, Prof. Dr. Hermann Eul, member of the company’s management board and head of its Communication Solutions business group, will participate as a keynote speaker on “ICs for Mobile Multimedia Communications” at the Conference Plenary Session.

“At Infineon, innovation in IC design is key to our ability to deliver new capabilities and unique value to engineers designing advanced electronics systems.  We are proud to see the results of just a small part of our R&D program be recognized at the premier international conference for semiconductor technology,” said Eul.

Summary information on Infineon’s participation at ISSCC is provided below, described by application.  For more details, please contact the media relations department.

Regular Papers and Evening Sessions

Communications Technology

Infineon is presenting three papers describing advances in wireline and wireless communications technology. They are:

• Session 6.5, “A WiMedia/MBOA-Compliant CMOS RF Transceiver for UWB”.
• Session 14.1, “A 90nm CMOS Low-Power GSM/EDGE Multimedia-Enhanced Baseband Processor with 380MHz ARM9 Core and Mixed-Signal Extensions”.
• Session 26.7, “A Fully Integrated SoC for GSM/GPRS in 0.13µm CMOS,” (i.e. a single-chip radio for mobile phones).

Memory

Infineon is presenting four papers that highlight company innovations in memory semiconductor technology:

• Session 4.5, “A 100mW 9.6Gb/s Transceiver in 90nm CMOS for Next-Generation memory Interfaces”.
• Session 7: “Signal-Margin-Screening for Multi-Mb MRAM”.
• Session 8.2, “A 2GB/s/pin 512Mb Graphics DRAM with Noise-Reduction Techniques”.
• Session 18.6, “Data Recovery and Retiming for 4.8Gb/s Fully Buffered DIMM Serial Links”.

IC Design

Infineon is presenting four papers describing developments in the general area of semiconductor design.  The papers are:

• Session 10.5, “A 10b 10GHz Digitally Controlled LC Oscillator in 65nm CMOS”.
• Session 12.6, “A 14b 100MS/s Digitally Self-Calibrated Pipelined ADC in 0.13µm CMOS”.
• Session 23.2, “Circuit Design Issues in Multi-Gate FET CMOS Technologies”.
• Session 23.3, “A Low-Power True Random Number Generator Using the Random Telegraph Noise of Single Oxide Traps”.

Sensors

In the area of advanced sensors, Infineon is presenting, in Session 16.6, a paper called “An Integrated Magnetic Sensor with Two Continuous-Time Sigma-Delta-Converters and Stress Compensation.”  Additionally, the company is participating in the Special-Topic Evening Session SE7: “Sensors on the Move”, focusing on tire pressure monitoring systems.

Biomedical

A paper on the design of IC’s for biomedical applications, completes the wide range of topics addressed by Infineon researchers. The company is presenting a paper in Session 2.1, “A 24x16 CMOS-Based Chronocoulometric DNA Microarray.”

Educational Events

In addition to the keynote speech and the regular papers Infineon representatives are also engaged in the educational events.  The day-long forum on “Advanced Wireless CMOS Transceivers” is organized by Infineon. Other sessions featuring Infineon researchers include a forum on: “Circuit Design in Emerging Technologies” and a tutorial on CMOS bio-sensors.  Finally, Infineon will participate in a forum on “High Speed Interconnect.”

The committment of Infineon to this leading conference is further underlined by its seven representatives serving in the conference organizing and program committees.  Dr. Rudolf Koch, coordinating R&D efforts for the Communication Solutions business group of Infineon, will serve as European Chair of the Conference for two years, beginning in February 2006.