Packaging
The products and services spectrum of the Security Packaging Center ranges from chip card modules for memories and controller ICs, modules for security ICs, customer specific package solutions and contract assembly.
|
Product description |
Typical Applications |
Pitch | Dimensions | Thickness | Contact surface | |
| Contact-based Controller Modules | ||||||
|
S-MFC5.8 |
Contact-based module
|
Payment, GSM |
14.25mm | 13 x 11.8mm | max. 538μm | NiAu |
| S-MFC5.6 | Contact-based module
6 Contacts FCOS™ technology PET Tape Flip Chip |
Payment, GSM | 9.5mm | 11 x 8.3mm | max. 538μm | NiAu |
| P-M5.1 | Contact-based module
8 Contacts Epoxy Tape Wire Bond Mold |
Payment,
Government Identification |
14.25mm | 13 x 11.8mm | max. 600μm | CIN+ |
| T-M5.1 | Contact-based module
8 Contacts Epoxy Tape Wire Bond Glob Top |
Payment,
Government Identification, GSM |
14.25mm | 13 x 11.8mm | max. 580μm | CIN+ |
| T-M5.3 | Contact-based module
8 Contacts Epoxy Tape Wire Bond Glob Top |
Pay TV | 14.25mm | 13 x 11.8mm | max. 580μm | CIN+ |
| T-M4.9 | Contact-based module
8 Contacts Epoxy Tape Wire Bond Glob Top |
Payment, Government
Identification |
14.25mm | 13 x 11.8mm | max. 580μm | CIN |
| T-M4.8 | Contact-based module
8 Contacts Epoxy Tape Chip Cavity Wire Bond Glob Top |
GSM | 14.25mm | 13 x 11.8mm | max. 580μm | CIN |
| S-MFC3.1 | Contact-based module
6 Contacts FCOS ™ technology PET Tape Flip Chip |
Healthcare/Social
Security Card, Ticketing, Loyalty, Access Control |
9.5mm | 11 x 8.3mm | max. 538μm | NiAu |
| T-M3.2 | Contact-based module
6 Contacts Epoxy Tape Chip Cavity Wire Bond Glob Top |
Healthcare/Social
Security Card, Ticketing, Loyalty, Access Control |
9.5mm | 11 x 8.3mm | max. 580μm | CIN |
| Contactless Controller & Memory Module | ||||||
| P-MCC8-2-3 | 2 Antenna Contacts
Wire Bond + Mold + Leadframe |
Payment, Access Control,
e-Passport, Driver’s License, Transport, Identification, Ticketing |
9.5mm | 8.1 x 5.15mm | max. 340μm | Ag |
| P-MCC2-2-1 | 2 Antenna Contacts
Wire Bond + Mold + Leadframe |
Transport,
Access Control |
4.75mm | 10.3 x 2.9mm | max. 340μm | Ag |
| P-FTM8-2-1 | 2 Antenna Contacts
Wire Bond + Mold + Epoxy Tape Controller only |
e-Passport,
Driver’s License |
9.5mm | 8.2 x 5.7mm | max. 260μm | NiAu |
| Dual Interface Module | ||||||
| T-M8.4 | Dual Interface Module
8 Contacts CB 2 Antenna Contacts Epoxy Tape Wire Bond Glob Top |
Payment, EMV SDA/DDA,
ePurse, Loyalty, Access Control, Driver’s License, Transport, Ticketing |
14.25mm | 13 x 11.8mm | max. 580μm | NiAu/NiAuPd |
| P-M8.4 | Dual Interface Module
8 Contacts CB 2 Antenna Contacts Epoxy Tape Wire Bond Mold |
Payment, e-Passport | 14.25mm | 13 x 11.8mm | max. 620μm | NiAu |
| SMD Packages | ||||||
| DSO-20 | Surface Mount Device
Lead |
Embedded Security
Authentication Ingetrity |
1.27mm | 12.8 x 7.6mm | max. 2.64mm | Sn |
| TSSOP-28 | Surface Mount Device
Lead |
Embedded Security
Trusted Platform Module |
0.65 mm | 9.7 x 4.4 mm | max. 1.1mm | Sn |
| VQFN-8 | Surface Mount Device
Small Outline No-Lead Exposed pad |
Embedded Security
Authentication Ingetrity |
1.27mm | 5 x 6 mm | max. 900μm | NiPdAuAg |
| VQFN-10 | Surface Mount Device
Small Outline No-Lead Exposed pad |
Embedded Security
Authentication Ingetrity |
1.27mm | 6 x 5 mm | max. 900μm | NiPdAuAg |
| WQFN-6 | Surface Mount Device
Small Outline No-Lead Exposed pad |
Embedded Security
Authentication |
0.65 mm | 2.5 x 2.5 mm | max. 800μm | Sn |
- Documents
- Contact us
Document Types
| Title | Date | Version | Size |
|---|---|---|---|
Product Brochure
|
|||
Chip Card Brochure (Infineon_Chip_Card_and_Security_ICs.pdf) |
30 Okt 2009 | 610 KB | |
|
Product Family Overview
|
|||
Chip Card Product Overview (Infineon_Chip_Card_and_Security_ICs_Portfolio.pdf) |
30 Okt 2009 | 1.6 MB | |
|
Info Sheet
|
|||
| 15 Jun 2009 | 02/2005 | 128 KB | |