Publications

Before the conversion towards lead-free products can take place, a lot of development work was necessary to understand mechanisms and effects based on new materials or different process conditions. To gain a common knowledge troughout the community Infineon Technologies was presenting its experiences during several international conferences. Here you can find the papers which where presented there.

Title and Description Size Date
Proc SEMI Technology Symposium, Advanced Packageing Technologies II;
P. Oberndorff, M. Dittes, L. Petit, C. Chen, J. Klerk, E. de Kluizenaar;
"Tin Whiskers on Lead-free Plating"; August 2003, Singapore, pp 51-55		 1,2 MB 25 Jul 2005

Proc. on IPC / JEDEC 4th International Conference on Leadfree
Electronics Assemblies and Components;
M. Dittes, P. Oberndorff, P. Crema, , V. Schroeder;
"The Effect of Temperature Cycling on Tin Whisker Formation"

 409.8 KB 25 Jul 2005
ECTC 2003
Dittes, M.; Oberndorff, P.; Petit, L.;
"Tin Whisker Formation - Results, Test Methods and Countermeasurees";
Proc. 53rd Electronic Components & Technology Conference, New Orleans, L.A. 2003; pp. 822-826		 603.3 KB 25 Jul 2005
Soldertec IPC 2003
Oberndorff, P.; Dittes, M.; Petit, L.;
"Intermetallic Formation in Relation to Tin Whiskers";
Conference Proceedings of the IPC/Soldertec International Conference on Lead Free Electronics		 2.5 MB 25 Jul 2005
Soldering & Surface Mount Technology 2003
Dittes, M.; Walter, H.;
"Advanced alloy for lead-free solder balls";
Soldering & Surface Mount Technology; vol. 15, no.1, 2003; pp.50-54		 638.6 KB 25 Jul 2005
ECWC 2002
Dittes, M.;
"Lead-free Post-Mold Plating for Semiconductor Devices";
Proc. Electronic Circuit World Convention 9, Cologne 2002		 333.7 KB 25 Jul 2005
SMT 2002
Dittes, M.;
"Lead-free Elctroplated Layers as Solderable Finish for Semiconductor Devices";
SMT Hybrid Packaging;
Tutorial 2: Bleifreie elektrochemische Baugruppen; Nürnberg 2002		 126.7 KB 25 Jul 2005
Teststandards 2001
Dittes, M.
"Teststandards für 'grüne' Bauelemente"; FED Konferenzband Design
und Fertigung bleifreier Elektronik,
Tutorial: Der aktuelle Stand der bleifreien Verbindungstechnik in Deutschland und international.		 104.4 KB 25 Jul 2005
EPTC 2000
Dittes, M.;
"Green Packages - Requirements, Materials, Results";
Proc. 3rd Electronics Packaging Technology Conference; Singapore 2000; pp. 1-5		 1.8 MB 25 Jul 2005