Mobile Phone Platforms
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Our system platforms combine cost-optimized ICs, reference designs, feature rich software stacks with professional customer support throughout the value chain. Small size together with the flexible, modular concept of our system platform offers our customers the possibility to leverage one design into various fields of applications like mobile phones, mobile computing and telematics.
Key Benefits
- Faster time-to-market
- Scalable connectivity options
- Unprecedented flexibility
- Reduced cost-of-ownership
- Mature 3G protocol stack and IPC with complete & integrated SW solutions for 2G / 3.5G proven in networks worldwide
- Highly optimized for lowest component count, smallest form factor, and lowest power consumption
- Multiple standard support on the same processor by changing the software only (SDR)
Latest News
| Date |
Title |
Category |
| January 26, 2009 | Infineon has won the Innovation Award of German Industry for the best technological innovation in the category of “large-scale enterprises”. More ... | Business & Financial Press |
| January 20, 2009 | Infineon Brings Next Generation of its Ultra-Low-Cost Mobile Phone Chips to the Market; X-GOLD110 Offers World’s Highest Integration for Mobile Phone Chips. More ... | Technology Media |
| January 20, 2009 | Infineon Technologies AG has sold more than 100 million of its chips for the so called ultra-low-cost mobile phone segment. More ... | Business & Financial Press |
| November 18, 2008 | Next Generation of Monolithically Integrated Mobile Phone Chip is Optimized for Lowest System Costs and a Five Times Better Performance. More ... | Technology Media |
| May 30, 2008 | Infineon Introduces World's Smallest 3G Solutions for Cost Efficient HSDPA to High-end HSUPA Phones. More ... | Business & Financial Press |
| April 23, 2008 | Samsung Selects Infineon HSDPA Platform for HEDGE Mobile Phone Family. More... | Business & Financial Press |
| March 17, 2008 | Infineon sets yet another new trend: Lowest-cost mobile phone platform for Internet-based telephony. More ... | Business & Financial Press |
| March 17, 2008 | Infineon First to Bring Voice-over-WLAN to Low-Cost Mobile Handsets. More... | Technology Media |
| February 11, 2008 | Infineon introduces instant messaging including presence and e-mail functionality for smart entry mobile phones. More ... | Technology Media |
| February 7, 2008 | Music and Mobile Internet for Emerging Markets; Infineon Introduces 65-Nanometer Single-Chip Family for Low-cost Phones. More ... | Business & Financial Press |