Infineon transfers its 90-nanometer DRAM trench technology developed using 300mm wafers, to the Taiwanese Original Equipment Manufacturer Winbond. Infineon, in turn, holds an option for the memories produced using this technology.
Memory module for the next generation of servers:
Infineon successfully tests a newly developed advanced memory buffer chip, which will fulfill the speed and memory capacity requirements of future workstations and servers.
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Memory Products